Method and system for wafer level singulation

Patent metadata

Field	Value
Publication number	US-9502294-B2
Application number	US-201314075603-A
Country	US
Kind code	B2
Filing date	Nov 8, 2013
Priority date	Feb 18, 2011
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate includes a plurality of devices. The method also includes forming a mask layer on the semiconductor substrate, exposing a predetermined portion of the mask layer to light, and processing the predetermined portion of the mask layer to form a predetermined mask pattern on the semiconductor substrate. The method further includes forming the plurality of semiconductor dies, each of the plurality of semiconductor dies being associated with the predetermined mask pattern and including one or more of the plurality of devices and separating the plurality of semiconductor dies from the carrier substrate.

First claim

What is claimed is:

1. A system for singulation of a plurality of semiconductor dies, the system comprising:
a coating unit configured to:
receive an identification of defective devices;
from a continuous film on a semiconductor substrate;
remove an edge portion of the continuous film;
remove one or more central portions of the continuous film to form a remaining film, the one or more central portions being associated with the defective devices;
coat the edge portion with an adhesive material; and
form a patchwork of adhesive locations distributed across the semiconductor substrate by coating the one or more central portions with the adhesive material;

a bonding unit configured to join the patchwork of adhesive locations and the remaining film on the semiconductor substrate to a carrier substrate;
wherein the coating unit is further configured to form a mask layer on the semiconductor substrate;
a laser processing unit configured to expose a predetermined portion of the mask layer to laser light;
a development processing unit configured to form a predetermined mask pattern on the semiconductor substrate;
a singulation unit configured to for the plurality of semiconductor dies, each of the plurality of semiconductor dies being associated with the predetermined mask; and
a die separation unit configured to separate at least a subset of the plurality of semiconductor dies from the carrier substrate.

2. The system of claim 1 wherein the carrier substrate comprises a silicon substrate.

3. The system of claim 1 wherein the coating unit includes an edge bead removal (EBR) arm.

4. The system of claim 1 wherein the continuous film comprises an inert material.

5. The system of claim 4 wherein the inert material comprises an amorphous carbon material.

6. The system of claim 1 wherein the at least a subset of the plurality of semiconductor dies are not positioned at the one or more central portions.

7. The system of claim 1 wherein the singulation unit comprises a development unit and an etching unit.

8. The system of claim 1 wherein the laser processing unit comprises a laser source.

9. The system of claim 1 further comprising a cleaning unit.

10. The system of claim 1 wherein the laser processing unit, the development processing unit, and the singulation unit are a single unit.

Assignees

• Applied Materials Inc

Inventors

• Schuegraf Klaus
• Ramaswami Seshadri
• Rice Michael R
• Salek Mohsen S
• Bjorkman Claes H

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/0468

  comprising a chamber adapted to a particular process · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title