Probe module supporting loopback test

Patent metadata

Field	Value
Publication number	US-9500675-B2
Application number	US-201414331610-A
Country	US
Kind code	B2
Filing date	Jul 15, 2014
Priority date	Jul 15, 2013
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A probe module, which supports loopback test and is provided between a PCB and a DUT, includes a substrate, a probe base, two probes, two signal path switchers, and a capacitor. The substrate has two first connecting circuits and two second connecting circuits, wherein an end of each first connecting circuit is connected to the PCB. The probe base is provided between the substrate and the DUT with the probes provided thereon, wherein an end of each probe is exposed and electrically connected to one second connecting circuit, while another end thereof is also exposed to contact the DUT. Each signal path switcher is provided on the probe base, and respectively electrically connected to another end of one first and one second connecting circuits. The capacitor is provided on the probe base with two ends electrically connected to the two signal path switchers.

First claim

What is claimed is:

1. A probe module, which is provided between a printed circuit board (PCB) and a device-under-test (DUT) to perform a loopback test, comprising:
a substrate having two first connecting circuits and two second connecting circuits, wherein an end of each of the first connecting circuits is electrically connected to the PCB;
a probe base provided between the substrate and the DUT;
two probes embedded in the probe base, wherein each of the probes has two opposite ends exposed outside of the probe base to be connected to an end of one of the second connecting circuits and to contact a tested pad of the DUT respectively;
two signal path switchers provided on the probe base, wherein each of the signal path switchers is electrically connected to another ends of one of the first connecting circuits and one of the second connecting circuits; and
a capacitor provided on the probe base, wherein two ends of the capacitor are respectively electrically connected to the signal path switchers;
wherein the probe base is hollow, and the signal path switchers and the capacitor are either provided on a surface of the probe base which faces the substrate or received in the probe base.

2. The probe module of claim 1 , wherein each of the signal path switchers is an inductive device having two ends, which are respectively electrically connected to one of the first connecting circuits and to the capacitor and one of the second connecting circuits.

3. The probe module of claim 2 , wherein each of the inductive devices is a choke.

4. The probe module of claim 1 , wherein each of the signal path switchers is a relay having a first contact, a second contact, and a third contact, wherein the relay is controllable to make either a connection between the first contact and the second contactor, or another connection between the first contact and the third contact; the first contact is electrically connected to one of the second connecting circuits, the second contact is electrically connected to one of the first connecting circuits, and the third contact is electrically connected to the capacitor.

5. The probe module of claim 1 , wherein, when the signal path switchers and the capacitor are provided on the surface of the probe base which faces the substrate, the probe base is provided with a plurality of recesses on the surface facing the substrate, and the signal path switchers are respectively received in the recesses.

6. The probe module of claim 1 , wherein, when the signal path switchers and the capacitor are provided on the surface of the probe base which faces the substrate, the probe base is provided with a recess on the surface facing the substrate, and the capacitor is received in the recess.

7. The probe module of claim 1 , further comprising a plurality of conductors when the signal path switchers and the capacitor are received in the probe base, wherein the probe base is provided with a plurality of through holes on a surface facing the substrate to respectively accommodate the conductors therein; each conductor has one end electrically connected to one of the signal path switchers and another end which contacts one of the first connecting circuits or one of the second connecting circuits in a way that each of the signal path switchers is electrically connected to one of the first connecting circuits and one of the second connecting circuits.

8. The probe module of claim 7 , wherein each of the conductors is a flexible metal thimble.

9. A probe module, which is provided between a PCB and a DUT to perform a loopback test, comprising:
a substrate having two first connecting circuits and two second connecting circuits, wherein an end of each of the first connecting circuits is electrically connected to the PCB;
two probes having two opposite ends, wherein one of the ends of each of probes is electrically connected to an end of one of the second connecting circuits, while the other end thereof contacts a tested pad of the DUT;
two signal path switchers provided on the substrate, wherein each of the signal path switchers is electrically connected to another ends of one of the first connecting circuits and one of the second connecting circuits; and
a capacitor provided on the substrate, wherein two ends of the capacitor are respectively electrically connected to the signal path switchers;
wherein the signal path switchers and the capacitor are provided on a surface of the substrate which faces the probes.

10. The probe module of claim 9 , wherein each of the signal path switchers is an inductive device having two ends, which are respectively electrically connected to one of the first connecting circuits and to the capacitor and one of the second connecting circuits.

11. The probe module of claim 10 , wherein each of the inductive devices is a choke.

12. The probe module of claim 9 , wherein each of the signal path switchers is a relay having a first contact, a second contact, and a third contact, wherein the relay is controllable to make either a connection between the first contact and the second contactor, or another connection between the first contact and the third contact; the first contact is electrically connected to one of the second connecting circuits, the second contact is electrically connected to one of the first connecting circuits, and the third contact is electrically connected to the capacitor.

13. The probe module of claim 9 , wherein the substrate is provided with a plurality of recesses on the surface facing the probes, and the signal path switchers are respectively received in the recesses.

14. The probe module of claim 9 , wherein the substrate is provided with a recess on the surface acing the probes, and the capacitor is received in the recess.

15. The probe module of claim 9 , further comprising a probe base provided between the substrate and the DUT, wherein the probes are provided on the probe base; each of the probes has two opposite ends exposed outside of the probe base to be electrically connected to one of the second connecting circuits and to contact the tested pad of the DUT respectively.

Assignees

• Mpi Corp

Inventors

• Ku Wei-Cheng
• Lai Jun-Liang
• Chen Wei
• Liu Hsin Hsiang
• Chou Kuang Chung
• Huang Chan Hung

Classifications

• G01R31/31716

  Testing of input or output with loop-back · CPC title

• G01R1/07378

  using an intermediate adapter, e.g. space transformers (G01R1/07371 takes precedence) · CPC title

• G01R31/31905

  Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture · CPC title

• G01R1/07385 Primary

  using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester · CPC title