Method and device for determining the pressure distribution for bonding

Patent metadata

Field	Value
Publication number	US-9500541-B2
Application number	US-201114119023-A
Country	US
Kind code	B2
Filing date	Jun 6, 2011
Priority date	Jun 6, 2011
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution.

First claim

The invention claimed is:

1. A method for determining pressure distribution for bonding of a first substrate to a second substrate, the method comprising:
applying a measurement layer to any one of, the first substrate, the second substrate, and the first and second substrate,
depositing the first substrate on a first tool for holding the first substrate, introducing the second substrate in a region between the first substrate and a second tool located opposite the first tool, the second tool aligned to the first tool for bonding of the first substrate to the second substrate,
deforming the measurement layer to alter its shape by bringing the first and second tools closer to one another,
measuring deformation of the measurement layer, and
computing the pressure distribution based on the measurement of the deformation.

2. A method for determining pressure distribution for bonding of a first substrate to a second substrate, the method comprising:
introducing a measurement layer between a first tool for holding the first substrate and a second tool opposite the first tool, the second tool aligned to the first tool for bonding of the first substrate to the second substrate,
deforming the measurement layer to alter its shape by bringing the first and second tools closer to one another,
measuring deformation of the measurement layer,
computing the pressure distribution based on the measurement of the deformation, and
measuring the shape of the measurement layer before deformation of the measurement layer.

3. A method for determining pressure distribution for bonding of a first substrate to a second substrate, the method comprising:
introducing a measurement layer between a first tool for holding the first substrate and a second tool opposite the first tool, the second tool aligned to the first tool for bonding of the first substrate to the second substrate, wherein the measurement layer includes a fluid,
deforming the measurement layer to alter its shape by bringing the first and second tools closer to one another,
measuring deformation of the measurement layer, and
computing the pressure distribution based on the measurement of the deformation.

4. A method for determining pressure distribution for bonding of a first substrate to a second substrate, the method comprising:
introducing a measurement layer between a first tool for holding the first substrate and a second tool opposite the first tool, the second tool aligned to the first tool for bonding of the first substrate to the second substrate, wherein the measurement layer is distributed between the first tool and the second tool using dispensers,
deforming the measurement layer to alter its shape by bringing the first and second tools closer to one another,
measuring deformation of the measurement layer, and
computing the pressure distribution based on the measurement of the deformation.

5. The method as claimed in claim 1 , wherein deformation of the measurement layer is measured at a plurality of positions along the measurement layer.

6. A method for determining pressure distribution for bonding of a first substrate to a second substrate, the method comprising:
introducing a measurement layer between a first tool for holding the first substrate and a second tool opposite the first tool, the second tool aligned to the first tool for bonding of the first substrate to the second substrate, wherein the measurement layer is introduced by application of droplets,
deforming the measurement layer to alter its shape by bringing the first and second tools closer to one another,
measuring deformation of the measurement layer, and
computing the pressure distribution based on the measurement of the deformation.

7. The method as claimed in claim 1 , wherein the method further comprises:
introducing an adhesion-reducing layer between the measurement layer and at least one of: (i) the first substrate located between the measurement layer and the first tool and (ii) the second substrate located between the measurement layer and the second tool.

8. The method as claimed in claim 1 , wherein the method further comprises:
aligning the first substrate located between the measurement layer and the first tool with the second substrate located between the measurement layer and the second tool.

9. The method as claimed in claim 2 , wherein the shape of the measurement layer is measured after introducing the measurement layer between the first tool and the second tool.

10. The method as claimed in claim 3 , wherein the fluid is a curable material.

11. The method as claimed in claim 10 , wherein the curable material is plastically deformable after curing.

12. The method as claimed in claim 5 , wherein deformation of the measurement layer is optically measured at the plurality of positions along the measurement layer.

13. The method as claimed in claim 6 , wherein said droplets are applied to the first substrate and/or the second substrate.

Assignees

• Rebhan Bernhard
• Wimplinger Markus
• Burggraf Jürgen
• Ev Group E Thallner Gmbh

Inventors

• Rebhan Bernhard
• Wimplinger Markus
• Burggraf Jürgen

Classifications

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• G01L1/24 Primary

  by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis {using infrared, visible light, ultraviolet} · CPC title

• B30B15/062 Primary

  Press plates · CPC title

• G01L5/0085

  Force sensors adapted for insertion between cooperating machine elements, e.g. for measuring the nip force between rollers · CPC title

• G01L5/008

  Force sensors integrated in an article or a dummy workpiece · CPC title