Selective sputtering for pattern transfer

Patent metadata

Field	Value
Publication number	US-9493879-B2
Application number	US-201314042990-A
Country	US
Kind code	B2
Filing date	Oct 1, 2013
Priority date	Jul 12, 2013
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

Methods of patterning conductive layer with a mask are described. The methods include low-ion-mass sputtering of the conductive layer by accelerating (e.g. helium or hydrogen containing ions) toward a substrate which includes the patterned mask and the underlying conductive layer. The sputtering processes described herein selectively remove conductive layers while retaining mask material.

First claim

The invention claimed is:

1. A method of patterning a conductive layer, the method comprising:
transferring a substrate into a substrate processing region of a substrate processing chamber, wherein a portion of the substrate is the conductive layer;
flowing a sputtering gas into a sputtering generation region fluidly coupled to the substrate processing region while forming a sputtering plasma in the sputtering generation region, wherein the sputtering plasma is formed by applying a sputtering plasma power to form ions;
selectively removing portions of the conductive layer which are not covered by a patterned mask layer by bombarding exposed portions of the conductive layer with the ions accelerated towards the substrate with an accelerating potential, wherein the substrate is in the substrate processing region during the selective removal operation, wherein the sputtering generation region and the substrate processing region are devoid of molecules having mass greater than ten atomic mass units.

2. The method of claim 1 wherein the conductive layer comprises copper.

3. The method of claim 1 wherein the conductive layer consists essentially of copper.

4. The method of claim 1 wherein the conductive layer comprises at least one of iron, cobalt, magnesium, palladium, aluminum or platinum.

5. The method of claim 1 wherein the patterned mask layer comprises at least one of tantalum and tungsten.

6. The method of claim 1 wherein the patterned mask layer consists essentially of one or both of tantalum and tungsten.

7. The method of claim 1 wherein the patterned mask layer comprises at least one of tantalum oxide, tantalum nitride, tungsten oxide, tungsten nitride, rhenium or osmium.

8. The method of claim 1 wherein the sputtering generation region is in a separate compartment from the substrate processing region, wherein the sputtering generation region is differentially pumped relative to the substrate processing region yet fluidly coupled to the substrate processing region.

9. The method of claim 1 wherein the sputtering generation region is inside the substrate processing chamber.

10. The method of claim 1 wherein the sputtering plasma is attained by applying inductively-coupled power to the sputtering generation region.

11. The method of claim 1 wherein neither the sputtering gas nor the sputtering ions form chemical bonds with removed constituents of the conductive layer.

12. A method of patterning a conductive layer, the method comprising:
providing a patterned substrate having a conductive layer a patterned mask layer formed on the conductive layer, wherein the patterned substrate is in a substrate processing region of a substrate processing chamber;
flowing a sputtering gas into a sputtering generation region fluidly coupled to the substrate processing region while forming a sputtering plasma in the sputtering generation region, wherein the sputtering plasma is formed by applying a sputtering plasma power to form sputtering ions and wherein the sputtering generation region and the substrate processing region consist essentially of elements with atomic weights below ten atomic mass units;
selectively removing portions of the conductive layer which are not covered by the patterned mask layer by bombarding exposed portions of the conductive layer with the sputtering ions accelerated towards the substrate with an accelerating potential, wherein the substrate is in the substrate processing region during the selective removal operation.

13. The method of claim 12 wherein the sputtering generation region and the substrate processing region consist essentially of elements with atomic weights below six atomic mass units.

14. The method of claim 12 wherein the sputtering gas comprises at least one of helium and hydrogen (H 2 ).

15. A method of patterning a copper layer, the method comprising:
flowing a sputtering gas into a sputtering generation region of the substrate processing chamber while forming a sputtering plasma in the substrate processing chamber, wherein the sputtering plasma is formed by applying a sputtering plasma power to form sputtering ions, wherein the sputtering gas consists essentially of one or more of atomic hydrogen (H), hydrogen (H z ) and helium;
selectively removing portions of the copper layer which are not covered by a patterned mask layer formed on the conductive layer by bombarding exposed portions of the conductive layer with sputtering ions accelerated towards the substrate with an accelerating potential, wherein the patterned mask layer comprises tungsten or tantalum and wherein the sputtering generation region and the substrate processing region are devoid of molecules having mass greater than ten atomic mass units.

Assignees

• Applied Materials Inc
• IBM

Inventors

• Hoinkis Mark
• Miyazoe Hiroyuki
• Joseph Eric

Classifications

• H10P50/262

  by physical means only · CPC title

• H01J37/321

  the radio frequency energy being inductively coupled to the plasma · CPC title

• C23F4/00 Primary

  Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00 · CPC title

• H01L21/32131

  Electricity · mapped topic