Methods for etching a metal layer to form an interconnection structure for semiconductor applications
US-9960052-B2 · May 1, 2018 · US
Hoinkis Mark is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hoinkis Mark |
| Total patents | 5 |
| First publication | Jan 15, 2015 |
| Latest publication | May 1, 2018 |
Publications ranked by popularity score, then publication date.
US-9960052-B2 · May 1, 2018 · US
US-9493879-B2 · Nov 15, 2016 · US
US-2015287634-A1 · Oct 8, 2015 · US
US-9114438-B2 · Aug 25, 2015 · US
US-2015014152-A1 · Jan 15, 2015 · US
Latest publications not already listed above.
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 5 |
| IBM | 3 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01J37/321 | 5 |
| H10P50/262 | 2 |
| C23F4/00 | 2 |
| H10W20/0633 | 2 |
| H10P50/71 | 2 |