Hot-melt composition
US-2024059931-A1 · Feb 22, 2024 · US
US9487684B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9487684-B2 |
| Application number | US-201314389596-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 25, 2013 |
| Priority date | Apr 17, 2012 |
| Publication date | Nov 8, 2016 |
| Grant date | Nov 8, 2016 |
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Adhesive compound as a permeant barrier, comprising (i) block copolymers having a construction A-B-A, (A-B) n , (A-B) n X, or (A-B-A) n X, where X is the radical of the coupling reagent, n is a whole number between 2 and 10, A is a polymer made of a vinyl aromatic compound and B is a polymer block made of an alkene or diene, wherein this polymer block can also be hydrated, with the condition that at least part of the A blocks is sulfonated, optionally with two-block copolymers in the form of A-B as an admixture component, and (ii) at least one tackifier resin.
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The invention claimed is: 1. An adhesive comprised of (i) block copolymers and also mixtures thereof, having an A-B-A, (A-B) n X, or (A-B-A) n X construction, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, and where the A blocks are sulfonated to the extent of 0.5 to 50 mol %, based on the total monomer units of the A blocks, and diblock copolymers of the form A-B optionally as admixture component, and (ii) at least one tackifier resin. 2. The adhesive as claimed in claim 1 , wherein B is a hydrogenated polymer block of an alkene or diene. 3. The adhesive as claimed in claim 1 wherein 0.5 to 50 mol % of the block copolymers are in the form of sulfonated copolymers and have sulfonated A blocks, the aromatic moieties of which are sulfonated to an extent of 0.5 to 20 mol % per mole of the monomer unit, based on the total monomer units of the A blocks in the sulfonated copolymer. 4. The adhesive as claimed in claim 1 , further comprising (iii) at least one metal complex with a substitutable complexing agent. 5. The adhesive as claimed in claim 1 , wherein the admixture component is a diblock copolymer of the form A-B, a copolymer with polymer blocks A′ of vinylaromatics and polymer blocks B′ of an alkene or diene. 6. The adhesive as claimed in claim 1 , wherein (i) the A blocks each independently have a T g of more than 40° C. and the B blocks each independently have a T g of less than 0° C. 7. The adhesive as claimed in claim 1 , wherein the B blocks independently are homopolymers or copolymers of monomers selected from the group consisting of ethylene, propylene and 1,3-dienes. 8. The adhesive as claimed in claim 1 , wherein the B blocks are at least partially hydrogenated. 9. The adhesive as claimed in claim 1 , wherein the A blocks independently are homopolymers or copolymers of monomers of at least one vinylaromatic. 10. The adhesive as claimed in claim 1 , wherein the metal complex with a substitutable complexing agent corresponds to a metal chelate of the formula I, (R 1 O) n M(XR 2 Y) m (I) where M is a metal selected from the group consisting of metals of main groups 2, 3, 4, and 5 of the Periodic Table of the Elements and from the transition metals, and R 1 is an alkyl or aryl group, n is 0 or a larger integer X and Y in the chelate ligand (XR 2 Y) independently are oxygen or nitrogen, which are optionally bonded to R 2 by a double bond, R 2 is an alkylene group which joins X and Y and which is linear or branched, and optionally has heteroatom(s) in the alkylene group, nitrogen, or sulfur; m is an integer, but is at least 1. 11. The adhesive as claimed in claim 10 , wherein the chelate ligand in the metal chelate is formed from the reaction of at least one of the compounds selected from the group consisting of triethanolamine, 2,4-pentanedione, 2-ethyl-1,3-hexanediol and lactic acid. 12. The adhesive as claimed in claim 1 , wherein the overall composition of the adhesive contains (ii) at 10 to 70 wt %, at least one tackifier resin, and/or an epoxy resin, and (iii) at least one metal complex with a substitutable complexing agent, and optionally (iv) up to 20 wt %, a plasticizer, and (v) 0.0 to 20 wt %, fillers, additives, photoinitiators, accelerators and/or curing agents, (vi) up to 60 wt %, a reactive resin, and (i) the block copolymers and/or mixtures comprising them, to 100 wt %. 13. The adhesive as claimed in claim 8 , wherein the fraction in wt % of the vinylaromatics of the A blocks in the (i) copolymer in relation to the overall composition of the adhesive is at least 20 to 85 wt %. 14. The adhesive as claimed in claim 1 , wherein the molar ratio of the sulfonic acid groups in the (i) sulfonated copolymer to the ligand (XR 2 Y) in the (iii) metal complex of the formula I is in the range from 1:3 to 3:1, with a fluctuation range of plus/minus 0.5. 15. The adhesive as claimed in claim 1 , having a SAFT of greater than or equal to 150° C. 16. The adhesive as claimed in claim 1 , comprising as tackifier resins at least one hydrogenated hydrocarbon resin. 17. The adhesive as claimed in claim 1 , comprising an epoxy resin, an acrylate and/or a methacrylate, and wherein the adhesive, optionally together with at least one reactive resin, comprises at least one photoinitiator absorbing UV light below 350 nm. 18. The adhesive as claimed in claim 1 , wherein the chelate-crosslinked adhesive has a WVTR of less than or equal to 100 g/m 2 ·d, and/or the chelate-crosslinked adhesive has an OTR of less than or equal to 3000 g/m 2 ·d·bar. 19. The adhesive as claimed in claim 1 , said adhesive being a pressure-sensitive adhesive or a hotmelt adhesive. 20. A process for producing an adhesive which comprises mixing (i) block copolymers and also mixtures thereof, having an A-B-A, (A-B) n X, or (A-B-A) n X construction, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, this polymer block being hydrogenated, with the proviso that at least some of the A blocks are sulfonated, and diblock copolymers of the form A-B, optionally, as admixture component, and (ii) at least one tackifier resin. 21. The process for producing an adhesive as claimed in claim 20 , wherein additionally (iii) at least one metal complex with a substitutable complexing agent and optionally as (ii) tackifier resin a substantially fully hydrogenated hydrocarbon resin, (iv) a plasticizer, and optionally (v) a filler, additive, accelerator, photoinitiator and/or optionally (vi) a reactive resin, together with at least one photoinitiator, are added. 22. An adhesive obtainable by a process according to claim 20 . 23. A method for applying the adhesive of claim 1 to an element, wherein the adhesive is partially crosslinked prior to application or is partially crosslinked or crosslinked to completion after application, by heating of the adhesive and/or of the element before, during, or after the application of the adhesive to the element. 24. The method of claim 23 , wherein the adhesive is thermally partially crosslinked prior to an application, and following the application, crosslinking to completion is accomplished thermally and/or with UV light after the application. 25. An adhesive assembly for formation of temperature-stable barrier layers, having a SAFT of greater than or equal to 180° C., for preventing the diffusion of permeants, for encapsulating an electronic arrangement, or for encapsulating an optoelectronic arrangement, wherein said assembly comprises the adhesive of claim 1 . 26. A sheetlike bonding means comprising the adhesive of claim 1 , the sheetlike bonding means being a sheetlike element of the adhesive or an adhesive tape, the adhesive tape having a carrier and, on at least one side of the carrier, the applied adhesive, and the adhesive of the sheetlike bonding means being substantially dried.
Sulfonation; Sulfation · CPC title
involving heating of the applied adhesive · CPC title
Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers · CPC title
modified · CPC title
organic · CPC title
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