Hot-melt composition
US-2024059931-A1 · Feb 22, 2024 · US
modified
modified · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09J153/025 |
| Official title | {modified} |
| Display label | modified |
| Total patents | 276 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 19 |
| 2016 | 22 |
| 2017 | 24 |
| 2018 | 28 |
| 2019 | 32 |
| 2020 | 33 |
| 2021 | 26 |
| 2022 | 26 |
| 2023 | 15 |
| 2024 | 26 |
| 2025 | 19 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Clear hot melt adhesives
US-2017292048-A1 · Oct 12, 2017 · US
Adhesive layer-equipped laminate, and flexible copper-clad laminate sheet and flexible flat cable using same
US-2017259544-A1 · Sep 14, 2017 · US
Hot melt adhesive
US-9758704-B2 · Sep 12, 2017 · US
Thermoplastic polymer composition and molded article
US-2017226390-A1 · Aug 10, 2017 · US
Composition, process for producing sheet, sheet, laminate, and laminate with device wafer
US-2017198176-A1 · Jul 13, 2017 · US
Hot melt adhesive composition comprising at least one particular aldehyde scavenger
US-2017166785-A1 · Jun 15, 2017 · US
Hydrogenated block copolymer pellet, adhesive composition, and surface protection film
US-9676974-B2 · Jun 13, 2017 · US
Thermoplastic polymer composition and molded article
US-9670354-B2 · Jun 6, 2017 · US
Composition and Surface Protection Film
US-2017145206-A1 · May 25, 2017 · US
Adhesive composition, laminate, and stripping method
US-2017148659-A1 · May 25, 2017 · US
Optically clear hot melt adhesives and uses thereof
US-2017145267-A1 · May 25, 2017 · US
High flow, hydrogenated styrene-butadiene-styrene block copolymers and applications
US-9637660-B2 · May 2, 2017 · US
Method for encapsulating an electronic arrangement
US-9627646-B2 · Apr 18, 2017 · US
Hydrogenated Block Copolymer Composition and Pressure-Sensitive Adhesive Composition
US-2017088757-A1 · Mar 30, 2017 · US
Styrenic block copolymer compositions
US-2017073513-A1 · Mar 16, 2017 · US
Transparent adhesive sheet
US-2017058148-A1 · Mar 2, 2017 · US
Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method
US-2017053821-A1 · Feb 23, 2017 · US
Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing method
US-2017004989-A1 · Jan 5, 2017 · US
Hydrogenated block copolymer pellet, adhesive composition, and surface protection film
US-2016326412-A1 · Nov 10, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C09J153/025?
- CPC C09J153/025 is the Cooperative Patent Classification code for “modified.”
- How many patents are filed under CPC C09J153/025 (modified)?
- Our database includes 276 publications tagged with this CPC code.
- Is patent activity under CPC C09J153/025 growing?
- Publication counts under this code: 26 in 2024 vs 19 in 2025 (latest complete years).