Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks

US9273231B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9273231-B2
Application numberUS-44027607-A
CountryUS
Kind codeB2
Filing dateSep 24, 2007
Priority dateOct 6, 2006
Publication dateMar 1, 2016
Grant dateMar 1, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Heat activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composition having at least an acid-modified or acid anhydride-modified vinylaromatic block copolymer, and epoxide compound and a metal chelate.

First claim

Opening claim text (preview).

The invention claimed is: 1. Heat-activable adhesive tape with an adhesive composed at least of a) an acid-modified or acid anhydride-modified vinylaromatic block copolymer, b) an epoxide-containing compound and, c) a metal chelate as crosslinker, said adhesive being crosslinkable in two separate crosslinking steps, one at room temperature and the second at a temperature above 150° C. 2. Heat-activable adhesive tape according to claim 1 , wherein the vinylaromatic block copolymer is a styrene block copolymer. 3. Heat-activable adhesive tape according to claim 1 wherein the epoxide-containing compound is an epoxy resin, an epoxidized polymer or a combination thereof. 4. Heat-activable adhesive tape according to claim 1 , wherein in the second crosslinking step the epoxide groups crosslink with the acid or acid anhydride groups of the vinylaromatic block copolymer. 5. Heat-activable adhesive tape according to claim 1 , wherein the metal chelate is represented by the formula (R 1 O) n M(XR 2 Y) m , where M is a metal from main group 2, 3, 4 or 5, or a transition metal, R 1 is an alkyl or aryl group, n is zero or a larger integer, X and Y are oxygen or nitrogen, which in each case may also be attached to R 2 by a double bond, R 2 is an alkylene group which connects X and Y and which may be branched, or else may contain oxygen or further heteroatoms, m is an integer, but is at least 1. 6. Heat-activable adhesive tape according to claim 1 , wherein the metal chelate is aluminium acetylacetonate or titanyl acetylacetonate. 7. Heat-activable adhesive tape according to claim 1 , wherein the adhesive tape comprises further acid anhydrides, further elastomers, tackifying resins, accelerators, dyes, carbon black, metal powders or combinations thereof. 8. Heat-activable adhesive tape according to claim 1 , wherein said acid-modified or acid anhydride-modified vinylaromatic block copolymer and said epoxide-containing compound are present in amounts whereby the amount of said epoxide-containing compound present is not more than 10% by weight of the amount of acid-modified or acid anhydride-modified elastomer present. 9. Method of adhesively bonding plastic parts, wherein said plastic parts are bonded with the heat-activable adhesive tape of claim 1 , having an adhesive comprising at least the acid-modified or acid anhydride-modified vinylaromatic block copolymer and an epoxy resin as the epoxide-containing compound. 10. A method for bonding plastic parts which comprises bonding said plastic parts with the heat-activable adhesive tape of claim 1 . 11. Method for bonding electronic components and/or flexible printed circuits (FPCBs) which comprises bonding said electronic components and/or flexible printed circuits with the heat-activable adhesive tape of claim 1 . 12. Method for bonding an object to polyimide which comprises bonding said object to polyimide with the heat-activable adhesive tape of claim 1 .

Assignees

Inventors

Classifications

  • Adhesives without diluent · CPC title

  • Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof · CPC title

  • Presence of block copolymer · CPC title

  • Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9273231B2 cover?
Heat activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composition having at least an acid-modified or acid anhydride-modified vinylaromatic block copolymer, and epoxide compound and a metal chelate.
Who is the assignee on this patent?
Krawinkel Thorsten, Tesa Se
What technology area does this patent fall under?
Primary CPC classification C09J7/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).