Absorbing termination in an interconnect

Patent metadata

Field	Value
Publication number	US-9485854-B2
Application number	US-201414464279-A
Country	US
Kind code	B2
Filing date	Aug 20, 2014
Priority date	Aug 20, 2014
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. A printed circuit board (PCB) assembly comprising:
a substrate;
at least one interconnect comprising a transmission line formed inside the substrate to route an electrical signal within the PCB, wherein at least one end of the transmission line reaches a surface of the PCB and is coupled with a connecting component that comprises a connector slot disposed on the surface of the PCB; wherein the connector slot is to receive a corresponding connecting element of an insertable component to be coupled with the PCB assembly, wherein at least a surface of the connecting element that faces the connector slot is directly covered with an absorbing material that is disposed to be in direct contact with at least a portion of the connector slot in response to insertion of the connecting element into the connector slot.

2. The PCB assembly of claim 1 , wherein the interconnect comprises a transmission line that includes the connecting component, wherein a second end of the transmission line that comprises the connecting component is disposed on the surface of the PCB to form a port for the electrical signal passing through the transmission line, wherein the port is covered with the absorbing material to form a first absorbing terminator to provide substantial termination of the electrical signal.

3. The PCB assembly of claim 2 , wherein a first end of the transmission line is connected to a transmitter to transmit the electrical signal through the transmission line, and wherein the port comprises the second end of the transmission line.

4. The PCB assembly of claim 3 , wherein the transmission line is a first transmission line, wherein the at least one interconnect further comprises a second transmission line disposed in proximity to the first transmission line, wherein the second transmission line includes a second absorbing terminator comprising a first end of the second transmission line covered with the absorbing material.

5. The PCB assembly of claim 4 , wherein the first end of the second transmission line is disposed in proximity to the first end of the first transmission line, wherein a second end of the second transmission line is connected to a receiver of a signal caused by magnetic interference from the electrical signal passing through the first transmission line, wherein an arrangement including the first and second transmission lines is to enable measurements of far end cross-talk (FEXT) associated with the electrical signal.

6. The PCB assembly of claim 4 , further comprising a third absorbing terminator disposed at a second end of the second transmission line, wherein an arrangement including the first and second transmission lines is to enable measurements of FEXT return loss associated with the electrical signal.

7. The PCB assembly of claim 4 , wherein a second end of the second transmission line is disposed in proximity to the first end of the first transmission line and connected to a receiver of a signal caused by magnetic interference from the electrical signal passing through the first transmission line, wherein an arrangement including the first and second transmission lines is to enable measurements of near end cross-talk (NEXT) associated with the electrical signal.

8. The PCB assembly of claim 1 , wherein the connecting component is a first connecting component, wherein the connector slot is a first connector slot, wherein the connecting element is a first connecting element, and wherein the insertable component is a first computing component to be coupled with the PCB assembly.

9. The PCB assembly of claim 8 , further comprising a second connecting component coupled with the at least one interconnect, wherein the second connecting component comprises a second connector slot to receive a corresponding second connecting element of a second computing component to be coupled with the PCB assembly.

10. The PCB assembly of claim 9 , wherein the absorbing material is in direct contact with an inside portion of the first connector slot in response to the insertion of the first connecting element of the first computing component into the first connector slot.

11. The PCB assembly of claim 10 , wherein the second computing component comprises a memory module to receive and store data comprising the electrical signal routed within the PCB, wherein the portion of the electrical signal to be at least partially absorbed by the first connecting component comprises a reflected portion of the electrical signal.

12. The PCB assembly of claim 1 , wherein the absorbing material has a dielectric loss tangent of greater than one, for a frequency range of a resonant frequency of a reflected portion of the electrical signal that is to be at least partially absorbed.

13. The PCB assembly of claim 12 , wherein a relative dielectric constant is inversely proportionate to the frequency of the reflected portion of the electrical signal that is to be at least partially absorbed.

14. The PCB assembly of claim 13 , wherein the dielectric loss tangent of the absorbing material is substantially constant for the resonant frequency range of the frequency of the reflected portion of the electrical signal that is to be at least partially absorbed.

15. The PCB assembly of claim 1 , wherein the at least one interconnect is capable of carrying the electrical signal that comprises a transmission signal transmitted with a speed above a threshold of about 1 gigabits per second (Gbps).

16. A method, comprising:
forming at least one interconnect on a printed circuit board (PCB) assembly to route electrical signals within the PCB, the forming including forming a transmission line inside the substrate to route an electrical signal within the PCB, and disposing a connecting component of the interconnect at least partially on a surface of the PCB, wherein the connecting component comprises a connector slot to receive a corresponding connecting element of an insertable component to be coupled with the PCB assembly; and
applying an absorbing material to at least a portion of the connecting component, including providing a direct contact between the connecting component and the absorbing material, to at least partially absorb a portion of the electrical signal, applying further including directly covering at least a surface of the connecting element that faces the connector slot with the absorbing material.

17. The method of claim 16 , wherein the disposing includes providing a first transmission line, with a first proximal end of the first transmission line comprising the connecting component forming a port for the electrical signal passing through the first transmission line, wherein applying the absorbing material includes covering the port with the absorbing material to form a first absorbing terminator to provide substantial termination of the electrical signal, the covering including retaining the absorbing material in place by fastening or gluing.

18. The method of claim 17 , further comprising:
connecting a first end of the first transmission line to a transmitter to transmit the electrical signal through the first transmission line, wherein the first proximal end of the first transmission line including the port comprises a second end of the first transmission line;
disposing a second transmission line in proximity to the first transmission line, the disposing including forming a second absorbing terminator at a second proximal end of the second transmission line by covering the second proximal end with the absorbing material, the covering including retaining the absorbing mate

Assignees

• Intel Corp

Inventors

• Huang Shaowu
• Xiao Kai
• Lee Beom-Taek
• Wu Boping
• Ye Xiaoning

Classifications

• H01P11/003

  Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K3/303

  with surface mounted components (H05K3/32 takes precedence) · CPC title

• H05K1/0216 Primary

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H05K1/0231

  Capacitors or dielectric substances · CPC title