Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

Patent metadata

Field	Value
Publication number	US-9478476-B2
Application number	US-201113976098-A
Country	US
Kind code	B2
Filing date	Dec 16, 2011
Priority date	Dec 16, 2011
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

A package for a microelectronic die ( 110 ) includes a first substrate ( 120 ) adjacent to a first surface ( 112 ) of the die, a second substrate ( 130 ) adjacent to the first substrate, and a heat spreader ( 140 ) adjacent to a second surface ( 111 ) of the die. The heat spreader makes contact with both the first substrate and the second substrate.

First claim

What is claimed is:

1. A package for a microelectronic die, the package comprising:
a first substrate adjacent to a first surface of the die;
a second substrate adjacent to the first substrate; and
a heat spreader adjacent to a second surface of the die, wherein the heat spreader makes contact with both the first substrate and the second substrate, wherein:
the first surface of the first substrate comprises a first side, a second side opposite the first side, a third side extending between the first side and the second side, and a fourth side opposite the third side;
the second substrate comprises a first surface and an opposing second surface, where the first surface of the second substrate is adjacent to the second surface of the first substrate;
the first surface of the second substrate comprises a fifth side, a sixth side opposite the fifth side, a seventh side extending between the fifth side and the sixth side, and an eighth side opposite the seventh side; and
the heat spreader makes contact with the first substrate at two or more of the first side, the second side, the third side, and the fourth side, and makes contact with the second substrate only at the fifth side and the sixth side and not at the seventh side and the eighth side.

2. The package of claim 1 wherein:
the first surface of the die defines a first plane;
the heat spreader makes contact with the first substrate at a first substrate contact area and makes contact with the second substrate at a second substrate contact area; and
the first substrate contact area is located in the first plane and the second substrate contact area is located in a second plane that is parallel to the first plane.

3. The package of claim 1 wherein:
the first substrate comprises a first surface and an opposing second surface, where the first surface of the first substrate is adjacent to the first surface of the die and the second surface of the first substrate is adjacent to the second substrate;
the first substrate comprises a first plurality of interconnects having a first pitch at the first surface of the first substrate and a second plurality of interconnects having a second pitch at the second surface of the first substrate; and
the first pitch is smaller than the second pitch.

4. The package of claim 1 wherein:
the first surface of the first substrate comprises a first side, a second side opposite the first side, a third side extending between the first side and the second side, and a fourth side opposite the third side;
the second substrate comprises a first surface and an opposing second surface, where the first surface of the second substrate is adjacent to the second surface of the first substrate;
the first surface of the second substrate comprises a fifth side, a sixth side opposite the fifth side, a seventh side extending between the fifth side and the sixth side, and an eighth side opposite the seventh side; and
the heat spreader makes contact with the first substrate only at the first side and the second side and not at the third side and the fourth side, and makes contact with the second substrate at two or more of the fifth side, the sixth side, the seventh side, and the eighth side.

5. The package of claim 1 wherein:
the heat spreader makes contact with the second substrate at a second substrate contact area located at an edge of the heat spreader; and
the edge of the heat spreader contains a step located above the second substrate contact area.

6. The package of claim 5 wherein:
the heat spreader makes contact with the first substrate at a first substrate contact area located at the edge of the heat spreader; and
the edge of the heat spreader contains a second step located above the first substrate contact area.

7. The package of claim 5 , wherein:
the contact surface is co-planar with the first surface of the die.

8. The package of claim 1 wherein:
the heat spreader comprises a first piece and a second piece;
the first piece comprises a cap;
the second piece comprises a base that makes contact with the first substrate at a first substrate contact area and makes contact with the second substrate at a second substrate contact area; and
the second piece contains a step located above the second substrate contact area.

9. A microelectronic assembly comprising:
an integrated circuit package;
a socket compatible with the integrated circuit package; and
an independent loading mechanism,
wherein:
the integrated circuit package comprises:
a die;
a first substrate;
a second substrate; and
a heat spreader that makes contact with both the first substrate and the second substrate;
the heat spreader comprises a step providing a contact surface; and

the independent loading mechanism makes contact with the heat spreader at the contact surface.

10. The microelectronic assembly of claim 9 wherein:
the first substrate comprises a first surface and an opposing second surface, where the first surface of the first substrate is adjacent to a first surface of the die and the second surface of the first substrate is adjacent to the second substrate;
the first substrate comprises a first plurality of interconnects having a first pitch at the first surface of the first substrate and a second plurality of interconnects having a second pitch at the second surface of the first substrate; and
the first pitch is smaller than the second pitch.

11. The microelectronic assembly of claim 9 wherein:
the first surface of the first substrate comprises a first side, a second side opposite the first side, a third side extending between the first side and the second side, and a fourth side opposite the third side;
the second substrate comprises a first surface and an opposing second surface, where the first surface of the second substrate is adjacent to the second surface of the first substrate;
the first surface of the second substrate comprises a fifth side, a sixth side opposite the fifth side, a seventh side extending between the fifth side and the sixth side, and an eighth side opposite the seventh side; and
the heat spreader makes contact with the first substrate at two or more of the first side, the second side, the third side, and the fourth side, and makes contact with the second substrate only at the fifth side and the sixth side and not at the seventh side and the eighth side.

12. The microelectronic assembly of claim 9 wherein:
the first surface of the first substrate comprises a first side, a second side opposite the first side, a third side extending between the first side and the second side, and a fourth side opposite the third side;
the second substrate comprises a first surface and an opposing second surface, where the first surface of the second substrate is adjacent to the second surface of the first substrate;
the first surface of the second substrate comprises a fifth side, a sixth side opposite the fifth side, a seventh side extending between the fifth side and the sixth side, and an eighth side opposite the seventh side; and
the heat spreader makes contact with the first substrate only at the first side and the second side and not at the third side and the fourth side, and makes contact with the second substrate at two or more of the fifth side, the sixth side, the seventh side, and the eighth side.

13. The microelectronic assembly of claim 9 wherein:
the heat spreader comprises a first piece and a second piece;
the first piece comprises a cap;
the second piece comprises a base that makes contact with the first substrate at a first substrate contact area and makes contact with the second substrate at a second substrate

Assignees

• Mallik Debendra
• Narasimhan Sridhar
• Manusharow Mathew J
• Boyd Thomas A
• Intel Corp

Inventors

• Mallik Debendra
• Narasimhan Sridhar
• Manusharow Mathew J
• Boyd Thomas A

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title