Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package
US-9478476-B2 · Oct 25, 2016 · US
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Patent family 48613051
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 48613051 |
| Family type | — |
| Earliest priority | Dec 16, 2011 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US9478476B2 — Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package |
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US9478476B2 — Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package (published Oct 25, 2016)
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