Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the same
US-2022325139-A1 · Oct 13, 2022 · US
taking regard of the speed
taking regard of the speed · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B49/006 |
| Official title | {taking regard of the speed} |
| Display label | taking regard of the speed |
| Total patents | 138 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 5 |
| 2017 | 7 |
| 2018 | 9 |
| 2019 | 10 |
| 2020 | 12 |
| 2021 | 9 |
| 2022 | 18 |
| 2023 | 14 |
| 2024 | 23 |
| 2025 | 23 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Floor grinding machine and method of operating floor grinding machine
US-11400557-B2 · Aug 2, 2022 · US
Floor Grinding Machine and Method of Operating Floor Grinding Machine
US-2022219278-A1 · Jul 14, 2022 · US
Substrate processing apparatus, substrate processing method, and storage medium that stores program to cause computer in substrate processing apparatus to execute substrate processing method
US-2021402548-A1 · Dec 30, 2021 · US
Indirect force control systems and methods used in robotic paint repair
US-2021394328-A1 · Dec 23, 2021 · US
Polishing pad, preparation method thereof and method for preparing semiconductor device using same
US-2021394335-A1 · Dec 23, 2021 · US
Robotic paint repair systems and methods
US-2021394336-A1 · Dec 23, 2021 · US
Closed loop control system for blade sharpening
US-2021291317-A1 · Sep 23, 2021 · US
Chemical-mechanical polishing system with a potentiostat and pulsed-force applied to a workpiece
US-2021291313-A1 · Sep 23, 2021 · US
Polishing pad and method for preparing semiconductor device using same
US-2021291315-A1 · Sep 23, 2021 · US
Machine Tool And Method Of Operating A Machine Tool
US-2021154798-A1 · May 27, 2021 · US
Method for processing semiconductor wafers using a grinding wheel
US-10974365-B2 · Apr 13, 2021 · US
Method for controlling repairing apparatus and repairing apparatus
US-2020391345-A1 · Dec 17, 2020 · US
Performance Grinding Solutions
US-2020306927-A1 · Oct 1, 2020 · US
Method for Processing Semiconductor Wafers Using a Grinding Wheel
US-2020298369-A1 · Sep 24, 2020 · US
Method of monitoring a dressing process and polishing apparatus
US-2020254585-A1 · Aug 13, 2020 · US
Method for forming semiconductor devices
US-10710210-B2 · Jul 14, 2020 · US
Method of monitoring a dressing process and polishing apparatus
US-10675731-B2 · Jun 9, 2020 · US
Systems and Methods for Obtaining Real-Time Abrasion Data
US-2020156210-A1 · May 21, 2020 · US
One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making
US-10654146-B2 · May 19, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B49/006?
- CPC B24B49/006 is the Cooperative Patent Classification code for “taking regard of the speed.”
- How many patents are filed under CPC B24B49/006 (taking regard of the speed)?
- Our database includes 138 publications tagged with this CPC code.
- Is patent activity under CPC B24B49/006 growing?
- Publication counts under this code: 23 in 2024 vs 23 in 2025 (latest complete years).