Method of repairing substrate

Patent metadata

Field	Value
Publication number	US-9468996-B2
Application number	US-201313957585-A
Country	US
Kind code	B2
Filing date	Aug 2, 2013
Priority date	Jan 3, 2013
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

A method of repairing a substrate that may prevent a metal layer from being corroded. A substrate including a metal layer and an insulating layer on the metal layer is first provided. Then, a laser beam having a wavelength range having a high transmittance with respect to the insulating layer is irradiated to selectively remove a portion of the metal layer. Also, a first laser beam is irradiated to remove a portion of the metal layer and a portion of the insulating layer, and then a second laser beam is irradiated onto side surfaces of the exposed insulating layer to melt the insulating layer, thereby forming a corrosion preventing layer covering the metal layer.

First claim

What claimed is:

1. A method of repairing a substrate, the method comprising:
providing a substrate including a metal layer and an insulating layer in direct contact with the metal layer; and
irradiating a laser beam having a first wavelength range in a direction perpendicular to the substrate to selectively remove a portion of the metal layer while leaving the insulating layer intact.

2. The method of claim 1 , wherein the laser beam is irradiated until at least the temperature of the metal layer arrives at a melting point of the metal layer.

3. The method of claim 1 , wherein the metal layer comprises a first meta layer, a second metal layer and a third metal layer,
the first metal layer and the third metal layer are short-circuited by the second metal layer, and
the laser beam is irradiated to remove the second metal layer.

4. The method of claim 1 , wherein the laser beam is irradiated using a wavelength variable solid laser.

5. The method of claim 1 , wherein the insulating layer is made of a silicon based material.

6. The method of claim 5 , wherein the insulating layer is made of silicon oxide.

7. The method of claim 6 , wherein the first wavelength range is about 2-6 μm.

8. A method of repairing a substrate, the method comprising:
providing a substrate including a metal layer and an insulating layer on the metal layer;
irradiating a first laser beam in a direction perpendicular to the substrate to selective remove a portion of the metal layer and a portion of the insulating layer;
irradiating a second laser beam onto a side surface of the exposed insulating layer to melt the side surface of the insulating layer; and
forming a corrosion preventing layer covering the side surface of the insulating layer by using some of the melted insulating layer.

9. The method of claim 8 , wherein the metal layer is made of a metal having a melting point higher than the insulating layer.

10. The method of claim 9 , wherein the second laser beam is irradiated until at least the temperature of the insulating layer arrives at the melting point of the insulating layer and before at least the temperature of the metal layer arrives at the melting point of the metal layer.

11. The method of claim 8 , wherein the insulating layer is made of a silicon based material.

12. The method of claim 11 , wherein the insulating layer is made of silicon oxide.

13. The method of claim 8 , wherein the second laser beam is irradiate with a predetermined slope with respect to a direction perpendicular to the substrate.

14. The method of claim 12 , wherein the second laser beam is irradiated to form a closed loop on a plane along the side surface of the insulating layer.

15. The method of claim 8 , wherein the metal layer comprises a first metal layer, a second metal layer and a third metal layer,
the first metal layer and the third metal layer are short-circuited by the second metal layer, and
the first laser beam is irradiated to remove the second metal layer and a portion of the insulating layer corresponding to the second metal layer.

Assignees

• Samsung Display Co Ltd

Inventors

• Ju Sung Bae

Classifications

• H10P34/42 Primary

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title

• Y10T29/49728

  and by a metallurgical operation, e.g., welding, diffusion bonding, casting · CPC title

• B23K26/354

  by melting · CPC title

• B23K26/40

  taking account of the properties of the material involved · CPC title

• B23K2103/50

  Inorganic materials other than metals or composite materials · CPC title