Semiconducitive catechol group encapsulant adhesion promoter for a packaged electronic device

Patent metadata

Field	Value
Publication number	US-9466544-B2
Application number	US-201313754086-A
Country	US
Kind code	B2
Filing date	Jan 30, 2013
Priority date	Jan 30, 2013
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

A packaged electronic device includes a package substrate, an electronic component die mounted to the package substrate, and an encapsulant bonded to a portion of the package substrate at a catechol group adhesion promoted interface that includes benzene rings bonded with the package substrate and the encapsulant.

First claim

What is claimed is:

1. A packaged electronic device, comprising:
a package substrate;
a catechol group adhesion promoter applied to the package substrate;
an electronic component attached to the package substrate, a first catechol group adhesion promoted interface formed between the electronic component and the package substrate;
an encapsulant bonded to a portion of the package substrate at a second catechol group adhesion promoted interface formed between the package substrate and the encapsulant.

2. The device of claim 1 , wherein the adhesion promoted interfaces include a plurality of benzene rings chemically bonded to a surface of the package substrate.

3. The device of claim 2 , wherein at least some of the plurality of benzene rings are chemically bonded to the encapsulant.

4. The device of claim 1 , further comprising:
a catechol group molecule between the encapsulant and the package substrate.

5. The device of claim 4 , wherein the catechol group molecule is characterized as one of a group consisting of dihydroxybenzene, dopamine, alpha-methyldopamine, norepinephrine, dihydroxyphenylalanine, alpha-methyldopa, droxidopa, and 5-hydroxydopamine.

6. The device of claim 1 , wherein the encapsulant remains bonded to the package substrate at temperatures ranging between −80 degrees Celsius and 300 degrees Celsius.

7. The device of claim 1 wherein the second catechol group adhesion promoted interface is located at a metal surface of the package substrate.

8. The device of claim 1 , further comprising:
a plurality of wire bonds electrically coupling the electronic component and the package substrate, wherein the encapsulant is located on surfaces of the plurality of wire bonds.

9. The device of claim 1 wherein the first and second catechol group adhesion promoted interfaces are characterized as a self assembled monolayer interface.

10. A packaged electronic device, comprising:
a package substrate including a surface;
an electronic device attached to a portion of the surface;
an encapsulant encapsulating the surface;
a self assembled monolayer interface formed between the surface and the encapsulant and formed between the portion of the surface and the electronic device, the self assembled monolayer interface including a plurality of molecules each including a benzene ring chemically bonded to the surface and to the encapsulant.

11. The packaged electronic device of claim 10 wherein the surface is characterized as a metal.

Assignees

• Uehling Trent S
• Freescale Semiconductor Inc

Inventors

• Uehling Trent S

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/01515

  Forming coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/075

  of bond wires · CPC title