Film for pressure-sensitive adhesive tape and pressure-sensitive adhesive tape

Patent metadata

Field	Value
Publication number	US-9460952-B2
Application number	US-201314237067-A
Country	US
Kind code	B2
Filing date	Feb 8, 2013
Priority date	Feb 28, 2012
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

A film for a pressure-sensitive adhesive tape is a film for a pressure-sensitive adhesive tape, including a non-pressure-sensitive adhesive layer on one surface of a plastic film, where the non-pressure-sensitive adhesive layer includes a mixed layer of a silicone and a (meth)acrylic polymer; and the (meth)acrylic polymer has a calculated Tg of 10° C. or more.

First claim

The invention claimed is:

1. A film for a pressure-sensitive adhesive tape, comprising a non-pressure-sensitive adhesive layer on one surface of a plastic film, wherein:
the non-pressure-sensitive adhesive layer comprises a mixed layer of a silicone and a (meth)acrylic polymer;
the (meth)acrylic polymer has a calculated Tg of 10° C. or more, and
the non-pressure-sensitive adhesive layer has a phase-separated structure;
the monomer components constituting the (meth)acrylic polymer contain a hydroxyl group-containing (meth)acrylic acid ester; and
the content of the hydroxyl group-containing (meth)acrylic acid ester in the monomer components constituting the polymer is 2 wt % to 30 wt % with respect to the total amount of the monomer components except the hydroxyl group-containing (meth)acrylic acid ester,
the non-pressure-sensitive adhesive layer has an arithmetic average surface roughness Ra of 0.1 μm or more, and
the non-pressure-sensitive adhesive layer has a non-pressure-sensitive adhesion test peel strength of less than 1.0 N/20 mm,
wherein the phase-separated structure includes a silicone-rich phase and a (meth)acrylic polymer-rich phase.

2. The film for a pressure-sensitive adhesive tape according to claim 1 , wherein the (meth)acrylic polymer has a solubility parameter (SP) value of 9.0 (cal/cm 3 ) 0.5 to 12.0 (cal/cm 3 ) 0.5 .

3. The film for a pressure-sensitive adhesive tape according to claim 1 , wherein the mixing ratio “silicone:(meth)acrylic polymer” between the silicone and the (meth)acrylic polymer in the non-pressure-sensitive adhesive layer is 1:50 to 50:1 in terms of a weight ratio.

4. The film for a pressure-sensitive adhesive tape according to claim 1 , wherein the non-pressure-sensitive adhesive layer has a thickness of 0.01 μm to 10 μm.

5. The film for a pressure-sensitive adhesive tape according to claim 1 , wherein the plastic film has a maximum elongation measured in accordance with JIS-K-7127 of 100% or more.

6. The film for a pressure-sensitive adhesive tape according to claim 1 , wherein the plastic film has a thickness of 20 μm to 200 μm.

7. The film for a pressure-sensitive adhesive tape according to claim 1 , wherein the plastic film contains at least a polyvinyl chloride.

8. A pressure-sensitive adhesive tape, comprising a pressure-sensitive adhesive layer on a surface of the plastic film in the film for a pressure-sensitive adhesive tape according to claim 1 opposite to the non-pressure-sensitive adhesive layer.

9. The pressure-sensitive adhesive tape according to claim 8 , wherein the pressure-sensitive adhesive layer contains at least one (meth)acrylic polymer.

10. The pressure-sensitive adhesive tape according to claim 8 , wherein the pressure-sensitive adhesive layer has an SP value of 9.0 (cal/cm 3 ) 0.5 to 12.0 (cal/cm 3 ) 0.5 .

11. The pressure-sensitive adhesive tape according to claim 8 , further comprising a release liner on a surface of the pressure-sensitive adhesive layer.

12. The pressure-sensitive adhesive tape according to claim 8 , wherein the pressure-sensitive adhesive tape is used in semiconductor processing.

13. The pressure-sensitive adhesive tape according to claim 8 , wherein the pressure-sensitive adhesive tape is used in an LED dicing application.

Assignees

• Nitto Denko Corp

Inventors

• Yutou Takumi
• Suzuki Toshitaka
• Shirai Masato
• Ando Masahiko
• Sekiguchi Yuka
• Asai Ryoko
• Endo Asuka
• Hayashiuchi Rie

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/742

  involving stretching of the auxiliary support post dicing · CPC title

• H10P72/7404

  the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer · CPC title

• H10P72/7402 Primary

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• Y10T428/266

  of base or substrate · CPC title