Edge crack detection system

Patent metadata

Field	Value
Publication number	US-9454684-B2
Application number	US-201414288462-A
Country	US
Kind code	B2
Filing date	May 28, 2014
Priority date	May 28, 2014
Publication date	Sep 27, 2016
Grant date	Sep 27, 2016

Abstract

According to an exemplary embodiment, a method of detecting edge cracks in a die under test is provided. The method includes the following operations: receiving a command signal; providing power from the command signal; providing a response signal based on the command signal; and self-destructing based on the command signal.

First claim

What is claimed is:

1. A method of detecting edge cracks in a die under test, comprising:
providing a command signal regarding a radio frequency identification (RFID) tag's response using an RFID reader;
completely encircling a die under test using an antenna of the RFID tag disposed outside a seal ring surrounding the entire periphery of the die under test;
using the RFID tag to receive the command signal and produce power from the command signal;
providing a response signal using the RFID tag based on the command signal;
receiving the response signal and providing the command signal regarding the RFID tag's self-destruction based on the response signal using the RFID reader; and
receiving the command signal and self-destructing based on the command signal using the RFID tag.

2. The method of claim 1 , further comprising disposing a processor of the RFID tag under the seal ring of the die.

3. The method of claim 1 , further comprising determining that the die under test has no edge cracks when receiving the response signal.

4. The method of claim 1 , further comprising no longer providing the response signal after the self-destruction of the RFID tag.

5. The method of claim 1 , further comprising having no impact to the die under test after the self-destruction of the RFID tag.

6. The method of claim 1 , further comprising comparing the command signal with a lookup table to determine whether to self-destruct.

7. The method of claim 1 , wherein providing the command signal by using the RFID reader further comprises providing the command signal in the form of an electromagnetic wave.

8. The method of claim 1 , wherein providing the response signal further comprises providing the response signal in the form of an electromagnetic wave.

9. An edge crack detection system, comprising:
a radio frequency identification (RFID) reader providing a command signal; and
an RFID tag wirelessly connected to the RFID reader, the RFID tag comprising an antenna completely encircling a die under test, the antenna disposed outside a seal ring surrounding the entire periphery of the die under test, wherein the antenna receives the command signal, produces power from the command signal, and provides a response signal based on the command signal,
wherein the RFID reader receives the response signal from the RFID tag and provides the command signal regarding the RFID tag's self-destruction based on the response signal from the RFID tag, and the RFID tag receives the command signal and self-destructs based on the command signal.

10. The system of claim 9 , wherein the RFID reader further determines that the die under test has no edge cracks when receiving the response signal.

11. The system of claim 9 , wherein after the self-destruction of the RFID tag, the RFID tag no longer provides the response signal.

12. The system of claim 9 , wherein after the self-destruction of the RFID tag, the RFID tag has no adverse impact to the die under test.

13. The system of claim 9 , wherein the RFID tag compares the command signal with a lookup table to determine whether to provide the response signal or to self-destruct.

14. The system of claim 9 , wherein the RFID reader provides the command signal in the form of an electromagnetic wave.

15. The system of claim 9 , wherein the RFID tag provides the response signal in the form of an electromagnetic wave.

16. The system of claim 9 , wherein the RFID tag further comprises: a processor disposed under the seal ring of the die.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Hsiao Huang-Ting
• Xu An-Tai
• Tsao Pei-Haw
• Tsai Cheng-Hung
• Chen Tsui-Mei
• Lu Nai-Cheng

Classifications

• H10P74/277

  Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• G06K19/0722 Primary

  comprising an arrangement for testing the record carrier · CPC title

• H01L21/304

  Electricity · mapped topic

• G06K7/10366 Primary

  the interrogation device being adapted for miscellaneous applications · CPC title