Victim cache that supports draining write-miss entries
US-2024264952-A1 · Aug 8, 2024 · US
US9984767B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9984767-B2 |
| Application number | US-201615240863-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 18, 2016 |
| Priority date | Sep 10, 2012 |
| Publication date | May 29, 2018 |
| Grant date | May 29, 2018 |
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Official abstract text for this publication.
A semiconductor device having a capability of generating chip identification information includes: an SRAM macro having a plurality of memory cells arranged in rows and columns; a test address storage unit configured to store a test address; a self-diagnostic circuit configured to output the test address based on a result of confirmation of operation of the memory cell selected by the test address; and an identification information generation circuit configured to generate chip identification information based on the test address which is output by the self-diagnostic circuit.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device for generating chip identification information, comprising: a memory cell array including a plurality of memory cells arranged in rows and columns; a voltage generation circuit configured to supply a power supply voltage to said memory cell array; a self-diagnostic circuit configured to determine mismatch of write data and read data of each of the plurality of memory cells; a test address storage unit configured to store a plurality of test addresses; and an identification information generation circuit; wherein, when chip identification information is generated, said voltage generation circuit is configured to lower said power supply voltage; said self-diagnostic circuit is configured to determine memory cells corresponding to said plurality of test addresses and output fail addresses; and said identification information generation circuit is configured to generate said chip identification information based on said fail addresses. 2. The semiconductor device according to claim 1 , wherein said test address storage unit is configured to store, as said test address, a defective cell address of said memory cell under a first measurement condition, said self-diagnostic circuit is configured to output said defective cell address based on a result of operational confirmation, under a third measurement condition, of said memory cell selected by said defective cell address, and a static noise margin for said memory cell under said first measurement condition is set larger than a static noise margin for said memory cell under said third measurement condition. 3. The semiconductor device according to claim 2 , wherein said test address storage unit is further configured to store, as said test address, a normal cell address of said memory cell under a second measurement condition, said self-diagnostic circuit is configured to make operational confirmation, under said third measurement condition, of said memory cell selected by said normal cell address, and a static noise margin for said memory cell under said third measurement condition is set larger than a static noise margin for said memory cell under said second measurement condition. 4. The semiconductor device according to claim 3 , wherein said power supply voltage under said first measurement condition is set larger than said power supply voltage under said third measurement condition. 5. The semiconductor device according to claim 4 , wherein said power supply voltage under said third measurement condition is set larger than said power supply voltage under said second measurement condition.
Indication or identification of errors, e.g. for repair · CPC title
Built-in arrangements for testing, e.g. built-in self testing [BIST] {or interconnection details} · CPC title
for memory cells of the field-effect type · CPC title
comprising an arrangement for testing the record carrier · CPC title
Acceleration testing · CPC title
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