Conductive particles, method for producing conductive particles, conductive material and connection structure

Patent metadata

Field	Value
Publication number	US-9446484-B2
Application number	US-201314379489-A
Country	US
Kind code	B2
Filing date	Feb 19, 2013
Priority date	Feb 21, 2012
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

Provided are a conductive particle and a conductive material which are capable of decreasing the connection resistance and suppressing generation of voids in a connection structure when the connection structure is obtained by electrically connecting electrodes. The conductive particle according to the present invention has a solder at a conductive surface, wherein a group including a carboxyl group is covalently bonded to the surface of the solder; and the conductive material according to the present invention includes the conductive particles and a binder resin.

First claim

The invention claimed is:

1. A conductive particle having a solder at a conductive surface,
the conductive particle being obtained by using a compound having a functional group capable of reacting with a hydroxyl group and having a carboxyl group and by allowing a hydroxyl group of the solder itself on the surface of the solder to react with the functional group capable of reacting with a hydroxyl group,
wherein a group including a carboxyl group is covalently bonded to the surface of the solder via an ether bond or an ester bond, and
the carboxyl group of the group including a carboxyl group is present on the surface of the solder.

2. The conductive particle according to claim 1 ,
wherein the functional group capable of reacting with a hydroxyl group is a hydroxyl group or a carboxyl group, and
when the functional group capable of reacting with a hydroxyl group is a carboxyl group, the compound has at least two carboxyl groups.

3. The conductive particle according to claim 1 ,
wherein conductive particle comprises a base particle; and a solder layer arranged on the surface of the base particle, and
the conductive particle has the solder derived from the solder layer at the conductive surface.

4. The conductive particle according to claim 3 ,
wherein the conductive particle further comprises a first conductive layer arranged between the base particle and the solder layer, and
the solder layer is arranged on the outer surface of the first conductive layer.

5. The conductive particle according to claim 1 ,
wherein the conductive particle is dispersed in a binder resin, and used as a conductive material.

6. A method for producing conductive particles, comprising a step of:
using conductive particles each having a solder at a conductive surface and mixing the conductive particles, a compound having a functional group capable of reacting with a hydroxyl group and having a carboxyl group, a catalyst and a solvent to allow a hydroxyl group of the solder itself on the surface of the solder to react with the functional group capable of reacting with a hydroxyl group and form conductive particles in which a group including a carboxyl group is covalently bonded to the surface of the solder via an ether bond or an ester bond, and the carboxyl group of the group including a carboxyl group is present on the surface of the solder.

7. The method for producing conductive particles according to claim 6 ,
wherein conductive particles each having a solder at a conductive surface are used, and
the conductive particles, the compound having a. functional group capable of reacting with a hydroxyl group and having a carboxyl group, the catalyst and the solvent are mixed and heated.

8. A conductive material comprising the conductive particle according to claim 1 , and a binder resin.

9. The conductive material according to claim 8 , which is an anisotropic conductive material,
wherein the content of the conductive particles in 100% by weight of the anisotropic conductive material is not less than 1% by weight and not more than 50% by weight.

10. A connection structure comprising:
a first connection object member having a first electrode on a surface;
a second connection object member having a second electrode on a surface; and
a connection part connecting the first connection object member and the second connection object member,
wherein the connection part is formed of the conductive particles according to claim 1 or formed of the conductive material including the conductive particles and a binder resin, and
the first electrode and the second electrode are electrically connected by the conductive particles.

Assignees

• Sekisui Chemical Co Ltd

Inventors

• Masui Ryohei
• Kubota Takashi
• Ishizawa Hideaki

Classifications

• B23K35/3618

  Carboxylic acids or salts · CPC title

• H01R4/04

  using electrically conductive adhesives · CPC title

• B23K35/3612

  with organic compounds as principal constituents · CPC title

• H05K2201/0784

  Uniform resistance, i.e. equalizing the resistance of a number of conductors · CPC title

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title