High-purity copper or high-purity copper alloy sputtering target, process for manufacturing the sputtering target, and high-purity copper or high-purity copper alloy sputtered film

Patent metadata

Field	Value
Publication number	US-9441289-B2
Application number	US-200913063050-A
Country	US
Kind code	B2
Filing date	Sep 24, 2009
Priority date	Sep 30, 2008
Publication date	Sep 13, 2016
Grant date	Sep 13, 2016

Abstract

Provided is a high-purity copper or high-purity copper alloy sputtering target of which the purity is 6N or higher and in which the content of the respective components of P, S, O and C is 1 ppm or less, wherein the number of nonmetal inclusions having a particle size of 0.5 μm or more and 20 μm or less is 30,000 inclusions/g or less. As a result of using high-purity copper or high-purity copper alloy from which harmful inclusions of P, S, C and O system have been reduced as the raw material and controlling the existence form of nonmetal inclusions, the present invention addresses a reduction in the percent defect of wirings of semiconductor device formed by sputtering a high-purity copper target so as to ensure favorable repeatability.

First claim

The invention claimed is:

1. A process for manufacturing a high-purity copper or high-purity copper alloy sputtering target, comprising the steps of:
providing a high purity copper anode and an aqueous nitric acid or hydrochloric acid solution as an electrolyte in an electrolytic cell for an electrolytic refining process, wherein an anode side of the electrolytic cell is separated from a cathode side with a diaphragm;
performing electrolysis in the electrolytic cell, extracting anolyte formed by the electrolysis, and filtering the extracted anolyte through an activated carbon filter immediately before supplying the filtered anolyte to the cathode side;
obtaining a high purity electrodeposited copper on the cathode as a raw material having a purity of 6N or higher, a content of 1 ppm or less of each of P, S, O and C impurity elements, and a structure containing nonmetal inclusions dispersed therein of a number of 30,000 inclusions/g or less for nonmetal inclusions having a size of 0.5 to 20 μm; and
melting the high purity electrodeposited copper with a cold crucible melting process or a vacuum arc remelting process and casting the molten copper to obtain a cast ingot of copper having a purity of 6N or higher, a content of 1 ppm or less for each of P, S, O and C impurity elements, and a structure containing nonmetal inclusions dispersed therein of a number of 30,000 inclusions/g or less for nonmetal inclusions having a size of 0.5 to 20 μm; or
melting the high purity electrodeposited copper with addition of at least one alloying element in a cold crucible melting process or a vacuum arc remelting process and casting the molten copper alloy to obtain a cast ingot of the high-purity copper alloy having a purity of a purity of 6N or higher, a content of 1 ppm or less for each of P, S, O and C impurity elements, and a structure containing nonmetal inclusions dispersed therein of a number of 30,000 inclusions/g or less for nonmetal inclusions having a size of 0.5 to 20 μm.

2. The process for manufacturing a high-purity copper or high-purity copper alloy sputtering target according to claim 1 , wherein the nonmetal inclusions having a size of 0.5 to 20 μm in the high purity electrodeposited copper and the ingot of copper or copper alloy are 15,000 inclusions/g or less.

3. The process for manufacturing a high-purity copper or high-purity copper alloy sputtering target according to claim 1 , wherein inclusions of carbon or carbide having a particle size of 0.5 to 20 μm in the high purity electrodeposited copper and the ingot of copper or copper alloy are 15,000 inclusions/g or less.

4. The process for manufacturing a high-purity copper or high-purity copper alloy sputtering target according to claim 3 , wherein the proportion of carbon or carbide in the nonmetal inclusions is 50% or less.

5. The process for manufacturing a high-purity copper or high-purity copper alloy sputtering target according to claim 1 , wherein the proportion of carbon or carbide in the nonmetal inclusions is 50% or less.

Assignees

• Fukushima Atsushi
• Shindo Yuichiro
• Shimamoto Susumu
• Jx Nippon Mining & Metals Corp

Inventors

• Fukushima Atsushi
• Shindo Yuichiro
• Shimamoto Susumu

Classifications

• C22C9/00

  Alloys based on copper · CPC title

• C23C14/564

  Means for minimising impurities in the coating chamber such as dust, moisture, residual gases · CPC title

• C23C14/185

  by cathodic sputtering · CPC title

• C23C14/3414 Primary

  Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy · CPC title

• H10D64/011

  of electrodes ohmically coupled to a semiconductor · CPC title