Infrared sensor

Patent metadata

Field	Value
Publication number	US-9435691-B2
Application number	US-201214003728-A
Country	US
Kind code	B2
Filing date	Mar 22, 2012
Priority date	Mar 30, 2011
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

A lightweight infrared sensor that detects a temperature at a portion spaced apart from a circuit substrate with high accuracy, is installed on the circuit substrate easily and stably, and includes an insulating film; a first and a second heat sensitive elements are disposed on one surface of the insulating film separately; a first conductive film on the insulating film that is connected to the first heat sensitive element; a second conductive film connected to the second heat sensitive element; an infrared reflection film on the other surface of the insulating film so as to face the second heat sensitive element; a plurality of terminal electrodes formed on one end of the insulating film and fitted into an external connector; an edge reinforcing plate adhered to one end of one surface of the insulating film; and a mounting hole that is formed on the other end.

First claim

What is claimed is:

1. An infrared sensor comprising:
an insulating film;
a first heat sensitive element and a second heat sensitive element that are disposed on one surface of the insulating film so as to be separated apart from one another;
a first conductive wiring film and a second conductive wiring film that are formed on one surface of the insulating film and are respectively connected to the first heat sensitive element and the second heat sensitive element;
an infrared reflection film that is disposed on the other surface of the insulating film so as to face the second heat sensitive element;
a plurality of terminal electrodes that are connected to the first wiring film and the second wiring film, are formed on one end of the other surface of the insulating film, and are configured to be fitted into an external connector of a circuit substrate in perpendicular to the substrate;
an edge reinforcing plate that is adhered to one end of one surface of the insulating film; and
a mounting hole that is formed on the other end of the insulating film and configured to be fixed to an external member with facing to the substrate.

2. The infrared sensor according to claim 1 , further comprising:
a sensor part reinforcing frame on which a sensor part window corresponding to the region of the first heat sensitive element, the second heat sensitive element, and the infrared reflection film is formed and which is adhered to one surface of the insulating film so as to surround the region.

3. The infrared sensor according to claim 1 , wherein a plurality of sensor parts each consisting of at least the first heat sensitive element, the second heat sensitive element, and the infrared reflection film is provided to the insulating film and all of the terminal electrodes corresponding to the sensor parts are formed on one end of the insulating film.

4. The infrared sensor according to claim 2 , wherein a sealing member for sealing the sensor part window is adhered to the sensor part reinforcing frame.

5. The infrared sensor according to claim 1 , wherein the first wiring film is arranged around the first heat sensitive element and is formed to have a larger area than that of the second wiring film.

Assignees

• Nakamura Kenzo
• Ishikawa Mototaka
• Uozumi Gakuji
• Mitsubishi Materials Corp

Inventors

• Nakamura Kenzo
• Ishikawa Mototaka
• Uozumi Gakuji

Classifications

• G01J5/0096 Primary

  for measuring wires, electrical contacts or electronic systems · CPC title

• G01J5/04

  Casings · CPC title

• G01J5/046

  Materials; Selection of thermal materials · CPC title

• G01J5/0205

  Mechanical elements; Supports for optical elements · CPC title

• G01J5/20

  using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices · CPC title