Infrared imaging device including drive and signal lines configured to electrically connect first and second substrates
US-11902696-B2 · Feb 13, 2024 · US
US2017191875A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017191875-A1 |
| Application number | US-201615244786-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 23, 2016 |
| Priority date | Dec 26, 2008 |
| Publication date | Jul 6, 2017 |
| Grant date | — |
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An infrared imaging probe that includes an elongated wand and an electrically isolating connection between the imaging components, located at the distal end of the wand, and the image processing components, located at the proximal end of the wand.
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What is claimed is: 1 . A method of thermally imaging components within an enclosed cabinet, comprising: providing (i) an infrared imaging system comprising a wand having a front-end assembly sized to fit through an access opening within a panel of the cabinet and coupled to a distal end of the wand, the front-end assembly including a lens, a focal plane array, and distal circuitry, the wand further including processing circuitry connected to and electrically isolated from the front-end assembly, and (ii) one or more output devices connected to the infrared imaging system; inserting the distal end of the wand through the access opening; and maneuvering the distal end of the wand to provide the lens a view of the components. 2 . The method of claim 1 , wherein the one or more output devices comprise one or more of a digital multimeter, a personal computer, a personal digital assistant, a display device, and a cellular phone. 3 . The method of claim 1 , wherein the access opening is approximately 12 mm in diameter. 4 . The method of claim 1 , wherein the processing circuitry is located proximate to a proximate end of the wand.
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