Application of fluids to substrates

Patent metadata

Field	Value
Publication number	US-9433962-B2
Application number	US-201514978507-A
Country	US
Kind code	B2
Filing date	Dec 22, 2015
Priority date	May 10, 2013
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

First claim

What is claimed is:

1. An apparatus comprising:
a first device comprising:
a substrate holder;
a glue application device configured to apply a glue to one of a semiconductor substrate or a carrier on the substrate holder;
a heating mechanism configured to locally heat the glue; and
a controller configured to control the heating mechanism to apply a local heating in order to obtain a desired thickness profile having a flatness with a predetermined tolerance of the glue on the one of the semiconductor substrate or the carrier; and

a second device comprising a grinding wheel configured to grind the semiconductor substrate mounted to the carrier with the glue sandwiched between the semiconductor substrate and the carrier.

2. The apparatus of claim 1 , wherein a viscosity of the glue is temperature-dependent.

3. The apparatus of claim 1 , wherein the heating mechanism comprises an infrared lamp.

4. The apparatus of claim 1 , wherein the substrate holder is rotatable.

5. The apparatus of claim 4 , wherein the glue application device is configured to apply the glue while the substrate holder rotates.

6. The apparatus of claim 4 , wherein the controller is configured to control the heating mechanism to locally heat the glue while the substrate holder rotates.

7. The apparatus of claim 1 , further comprising a fluid thickness measurement device, the apparatus being further configured to determine a local heating pattern through a calibration measurement using the fluid thickness measurement device.

8. The apparatus of claim 1 , wherein the substrate holder is configured to receive the semiconductor substrate.

9. The apparatus of claim 1 , wherein the local heating locally changes a behavior of the glue from an essentially non-Newtonian behavior to an essentially Newtonian behavior.

10. The apparatus of claim 7 , wherein the heating mechanism is configured to apply the heating based on the local heating pattern.

11. The apparatus of claim 10 , wherein the local heating pattern is a spatial heat pattern to be applied across the one of the semiconductor substrate or carrier.

Assignees

• Infineon Technologies Ag

Inventors

• Pilch Karl
• Leitner Hans
• Kalin Michael

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P14/6342

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title