EBG structure and circuit board

US9112475B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9112475-B2
Application numberUS-201313951875-A
CountryUS
Kind codeB2
Filing dateJul 26, 2013
Priority dateJul 27, 2012
Publication dateAug 18, 2015
Grant dateAug 18, 2015

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  1. Title

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  2. Abstract

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An EBG (Electromagnetic Band Gap) structure according to an embodiment includes: an electrode that is made of a first conductor; a first insulating layer that is provided on the electrode; a patch unit that is provided in substantially parallel with the electrode on the first insulating layer, the patch unit including a first gap, the patch unit being made of a second conductor; a second insulating layer that is provided on the patch unit; a first via that is provided between the patch unit in the first insulating layer and the electrode and connected to the patch unit and the electrode; and a second via that is provided in the first and second insulating layers, the second via piercing the first gap and being connected to the electrode.

First claim

Opening claim text (preview).

What is claimed is: 1. An EBG (Electromagnetic Band Gap) structure comprising: an electrode made of a first conductor; a first insulating layer provided on the electrode; a patch unit provided in substantially parallel with the electrode on the first insulating layer, the patch unit including a first gap, the patch unit being made of a second conductor; a second insulating layer provided on the patch unit; a first via provided between the patch unit and the electrode, the…

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What does patent US9112475B2 cover?
An EBG (Electromagnetic Band Gap) structure according to an embodiment includes: an electrode that is made of a first conductor; a first insulating layer that is provided on the electrode; a patch unit that is provided in substantially parallel with the electrode on the first insulating layer, the patch unit including a first gap, the patch unit being made of a second conductor; a second insula…
Who is the assignee on this patent?
Toshiba Kk
What technology area does this patent fall under?
Primary CPC classification H03H7/0138. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 18 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).