Processing apparatus having a first shield and a second shield arranged to sandwich a substrate

Patent metadata

Field	Value
Publication number	US-9425029-B2
Application number	US-201514597523-A
Country	US
Kind code	B2
Filing date	Jan 15, 2015
Priority date	Feb 17, 2014
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

A processing apparatus includes a supply source including a first supply source and a second supply source arranged to respectively face a first surface of a substrate and a second surface on an opposite side of the first surface. The supply source is configured to supply a material to apply a process to the substrate. A shield member includes a first shield provided around the first supply source and a second shield provided around the second supply source, the first shield and the second shield being arranged to sandwich the substrate. A moving device is configured to move the first shield and the second shield to set one of a close state in which the first shield and the second shield are close to each other and a separate state in which the first shield and the second shield are separate from each other.

First claim

What is claimed is:

1. A processing apparatus comprising:
a vacuum vessel;
a supply source including a first supply source and a second supply source arranged to respectively face a first surface of a substrate conveyed into the vacuum vessel and a second surface on an opposite side to the first surface and configured to supply a material to apply a process to the substrate;
a shield member including a first shield provided around the first supply source and a second shield provided around the second supply source, the first shield and the second shield being arranged to sandwich the substrate; and
a moving device configured to move the first shield and the second shield to set one of a first state in which the first shield and the second shield are arranged with respect to each other so as to form process spaces between the first shield and the second shield, and a second state in which the first shield and the second shield are further apart from each other than when in the first state,
wherein the shield member forms the process spaces between the first supply source and the substrate and between the second supply source and the substrate when the moving device moves the first shield and second shield to set the first state, and
the process is applied to the first surface and the second surface in the process spaces,
the processing apparatus further comprising a gas supply unit configured to supply a process gas into the vacuum vessel,
wherein the shield member includes gas inlets which are connected to the gas supply unit in the first state, and
when the moving device moves the first shield and the second shield to set the first state, the process gas is supplied from the gas supply unit into the process spaces via the gas inlets.

2. The apparatus according to claim 1 , wherein each of the first shield and the second shield includes a facing portion which faces the substrate conveyed into the vacuum vessel and a surrounding portion which extends from an outer circumference of the facing portion and surrounds the supply source, and
the facing portion has an opening at a position facing the substrate conveyed into the vacuum vessel.

3. A processing apparatus comprising:
a vacuum vessel;
a supply source including a first supply source and a second supply source arranged to respectively face a first surface of a substrate conveyed into the vacuum vessel and a second surface on an opposite side to the first surface and configured to supply a material to apply a process to the substrate;
a shield member including a first shield provided around the first supply source and a second shield provided around the second supply source, the first shield and the second shield being arranged to sandwich the substrate; and
a moving device configured to move the first shield and the second shield to set one of a first state in which the first shield and the second shield are arranged with respect to each other so as to form process spaces between the first shield and the second shield, and a second state in which the first shield and the second shield are further apart from each other than when in the first state,
wherein the shield member forms the process spaces between the first supply source and the substrate and between the second supply source and the substrate when the moving device moves the first shield and second shield to set the first state, and
the process is applied to the first surface and the second surface in the process spaces,
wherein the first shield includes a first convex portion protruding toward the second shield,
the second shield includes a first concave portion corresponding to the first convex portion, and
when the moving device moves the first shield and the second shield to set the first state, the first convex portion and the first concave portion constitute a nested structure for preventing the material generated in the process spaces from leaking from the process spaces to an outside space.

4. The apparatus according to claim 1 , wherein the shield member includes a first shield base which comes into contact with the first shield and a second shield base which comes into contact with the second shield,
the first shield includes a second convex portion protruding toward the first shield base,
the first shield base includes a second concave portion corresponding to the second convex portion,
the second shield includes a third convex portion protruding toward the second shield base,
the second shield base includes a third concave portion corresponding to the third convex portion,
the second convex portion and the second concave portion constitute a nested structure for reducing the material generated in the process spaces which leaks from the process spaces to an outside space, while the first shield is in contact with the first shield base, and
the third convex portion and the third concave portion constitute a nested structure for preventing the material generated in the process spaces from leaking from the process spaces to an outside space, while the second shield is in contact with the second shield base.

5. The apparatus according to claim 4 , wherein the first shield base has an opening surrounding the first supply source, and
the second shield base has an opening surrounding the second supply source.

6. The apparatus according to claim 1 , further comprising a holder configured to hold the substrate so as to expose the first surface and the second surface,
the holder includes a fourth convex portion protruding toward the first shield and a fifth convex portion protruding toward the second shield,
the first shield includes a fourth concave portion corresponding to the fourth convex portion,
the second shield includes a fifth concave portion corresponding to the fifth convex portion,
the fourth convex portion and the fourth concave portion constitute a nested structure for preventing the material generated in the process spaces from leaking from the process spaces to an outside space, while the moving device moves the first shield and the second shield to set the first state, and
the fifth convex portion and the fifth concave portion constitute a nested structure for preventing the material generated in the process spaces from leaking from the process spaces to an outside space, while the moving device moves the first shield and the second shield to set the first state.

7. The apparatus according to claim 1 , wherein the supply source is fixed in the vacuum vessel, and
the moving device moves the first shield and the second shield to set the first state when the process is applied to the substrate, and moves the first shield and second shield to set the second state at a time other than when the process is applied to the substrate.

8. A processing apparatus comprising:
a vacuum vessel;
a supply source including a first supply source and a second supply source arranged to respectively face a first surface of a substrate conveyed into the vacuum vessel and a second surface on an opposite side to the first surface and configured to supply a material to apply a process to the substrate;
a shield member including a first shield provided around the first supply source and a second shield provided around the second supply source, the first shield and the second shield being arranged to sandwich the substrate; and
a moving device configured to move the first shield and the second shield to set one of a first state in which the first shield and the second shield are arranged with respect to each other so as to form process spaces between the first shield and the second shield, and a second state in which the first shield and the second shield are further apart from each other than when in the first state

Assignees

• Canon Anelva Corp

Inventors

• Muto Yoshihiro
• Higashisaka Ryuji
• Yamada Satoshi

Classifications

• C23C14/34

  Sputtering · CPC title

• C23C14/042

  using masks · CPC title

• C23C14/568

  Transferring the substrates through a series of coating stations (C23C14/562 takes precedence) · CPC title

• H01J37/3441 Primary

  Dark space shields · CPC title

• C23C14/564

  Means for minimising impurities in the coating chamber such as dust, moisture, residual gases · CPC title