Exposure apparatus, exposure method, and device manufacturing method

Patent metadata

Field	Value
Publication number	US-9400434-B2
Application number	US-201414494050-A
Country	US
Kind code	B2
Filing date	Sep 23, 2014
Priority date	Sep 27, 2013
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

An exposure apparatus includes a controller configured to control scanning of an original holding unit and a substrate holding unit to expose a first pattern forming area onto a plurality of second pattern forming areas formed in advance on the substrate. The first pattern forming area is superimposed on the plurality of second pattern forming areas. An original may include the first pattern forming area in plural. The controller is configured to change the operation of the original holding unit or the substrate holding unit among the plurality of second pattern forming areas based on a state of the second pattern forming areas or a state of the first pattern forming areas while the first pattern forming areas are scanning-exposed onto the plurality of second pattern forming areas in a single scanning between the original holding unit and the substrate holding unit.

First claim

What is claimed is:

1. An exposure apparatus that exposes a pattern formed on an original onto a substrate as a first pattern forming area, the exposure apparatus comprising:
an original holding unit configured to hold the original;
a substrate holding unit configured to hold the substrate; and
a controller configured to control scanning of the original holding unit and the substrate holding unit so as to expose a plurality of the first pattern forming areas onto a plurality of second pattern forming areas, formed in advance on the substrate, with the plurality of the first pattern forming areas superimposed on the plurality of second pattern forming areas,
wherein the controller is configured to change an operation of the original holding unit for each of the plurality of second pattern forming areas based on a shape of the plurality of second pattern forming areas formed on the substrate or a shape of the pattern formed on the original, while the plurality of the first pattern forming areas are scanning-exposed onto the plurality of second pattern forming areas in a single scanning between the original holding unit and the substrate holding unit.

2. The exposure apparatus according to claim 1 , wherein the shape of the plurality of second pattern forming areas includes an arrangement of the plurality of second pattern forming areas.

3. The exposure apparatus according to claim 1 , wherein the controller is configured to change the operation of the original holding unit based on a magnification error or a rotational error between the plurality of the first pattern forming areas and the plurality of second pattern forming areas.

4. The exposure apparatus according to claim 1 , wherein a change in the operation of the original holding unit includes a change in at least a scan speed, a scan direction, a scan position, or an angle within a plane perpendicular to a direction of an optical axis of a projection optical system configured to expose the plurality of the first pattern forming areas onto the plurality of second pattern forming areas.

5. The exposure apparatus according to claim 2 , further comprising:
a measuring device configured to measure the shape or the arrangement of the plurality of second pattern forming areas formed on the substrate.

6. An exposure method for exposing a pattern formed on an original onto a substrate as a first pattern forming area, the exposure method comprising:
exposing a plurality of the first pattern forming areas onto a plurality of second pattern forming areas formed in advance on the substrate, with the plurality of the first pattern forming areas superimposed on the plurality of second pattern forming areas while scanning an original holding unit and a substrate holding unit, the original holding unit configured to hold the original, and the substrate holding unit configured to hold the substrate,
wherein an operation of the original holding unit is changed in the exposing based on a shape of the plurality of second pattern forming areas formed on the substrate or a shape of the pattern formed on the original, while the plurality of the first pattern forming areas are scanning-exposed onto the plurality of second pattern forming areas in a single scanning between the original holding unit and the substrate holding unit.

7. A device manufacturing method comprising:
exposing a substrate using an exposure apparatus; and
developing the exposed substrate,
wherein the exposure apparatus, which exposes a pattern formed on an original onto a substrate as a first pattern forming area, comprises:
an original holding unit configured to hold the original;
a substrate holding unit configured to hold the substrate; and
a controller configured to control scanning of the original holding unit and the substrate holding unit so as to expose a plurality of the first pattern forming areas onto a plurality of second pattern forming areas, formed in advance on the substrate with the plurality of the first pattern forming areas superimposed on the plurality of second pattern forming areas,
wherein the controller is configured to change an operation of the original holding unit for each of the plurality of second pattern forming areas based on a shape of the plurality of second pattern forming areas formed on the substrate or a shape of the pattern formed on the original, while the plurality of the first pattern forming areas are scanning-exposed onto the plurality of second pattern forming areas in a single scanning between the original holding unit and the substrate holding unit.

8. An exposure apparatus that exposes a pattern formed on an original onto a substrate as a first pattern forming area, the exposure apparatus comprising:
an original holding unit configured to hold the original;
a substrate holding unit configured to hold the substrate; and
a controller configured to control scanning of the original holding unit and the substrate holding unit so as to expose a plurality of the first pattern forming areas onto a plurality of second pattern forming areas, formed in advance on the substrate with the plurality of the first pattern forming areas superimposed on the plurality of second pattern forming areas,
wherein the controller is configured to change an operation of the original holding unit for each of the plurality of second pattern forming areas based on a shape of the plurality of the first pattern forming areas formed on the substrate or a shape of the pattern formed on the original, while the plurality of the first pattern forming areas are scanning-exposed onto the plurality of second pattern forming areas in a single scanning between the original holding unit and the substrate holding unit.

9. The exposure apparatus according to claim 8 , wherein the controller is configured to change the operation of the original holding unit based on a magnification error or a rotational error between the plurality of the first pattern forming areas and the plurality of second pattern forming areas.

10. The exposure apparatus according to claim 8 , wherein the shape of the plurality of the first pattern forming areas includes a shape or an arrangement of the plurality of the first pattern forming areas.

11. The exposure apparatus according to claim 8 , wherein the controller is configured to change the operation of the original holding unit based on the shape of the plurality of the first pattern forming areas in a case that a manufacturing error of the plurality of the first pattern forming areas exceeds an allowable range.

12. The exposure apparatus according to claim 8 , wherein a change in the operation of the original holding unit includes a change in at least a scan speed, a scan direction, a scan position, or an angle within a plane perpendicular to a direction of an optical axis of a projection optical system configured to expose the plurality of the first pattern forming areas onto the plurality of second pattern forming areas.

13. The exposure apparatus according to claim 10 , further comprising:
a position measuring device configured to measure positions of marks that are provided on the original so as to be aligned with positions where the plurality of the first pattern forming areas are formed,
wherein the controller is configured to determine the shape or the arrangement of the plurality of the first pattern forming areas based on the positions of the marks measured by the position measuring device.

14. An exposure method for exposing a pattern formed on an original onto a substrate as a first pattern forming area, the exposure method comprising:
exposing a plurality of the first pattern for

Assignees

• Canon Kk

Inventors

• Takenaka Tsutomu
• Mishima Kazuhiko

Classifications

• G03F7/70525

  Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure · CPC title

• G03F7/70458

  Mix-and-match, i.e. multiple exposures of the same area using a similar type of exposure apparatus, e.g. multiple exposures using a UV apparatus · CPC title

• G03F7/70191

  Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like · CPC title

• G03F7/70358 Primary

  Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging · CPC title

• H10P76/2041 Primary

  Photolithographic processes · CPC title