Through chip coupling for signal transport

Patent metadata

Field	Value
Publication number	US-9397729-B2
Application number	US-94607210-A
Country	US
Kind code	B2
Filing date	Nov 15, 2010
Priority date	Nov 15, 2010
Publication date	Jul 19, 2016
Grant date	Jul 19, 2016

Abstract

Through-chip coupling is utilized for signal transport, where an interface is formed between a first coil on a first integrated circuit (IC) chip and a second coil on a second IC chip. The first coil is coupled to an antenna. The second coil is coupled to an amplifier circuit. The second coil is not in direct contact with the first coil. The first coil and the second coil communicatively transmit signals between the antenna and the first amplifier circuit.

First claim

What is claimed is:

1. A method of transmitting a signal from an amplifier circuit to an antenna utilizing through-chip coupling, the method comprising:
at a first coil on a first integrated circuit (IC) chip of a three-dimensional (3D) IC package, receiving a transmission signal from a processing circuit;
wirelessly communicating the transmission signal from the first coil to a second coil on a second IC chip of the 3D IC package, wherein the first coil and the second coil are not in direct contact and wherein the first coil and the second coil vertically overlap, and wherein the first IC chip and the second IC chip form the 3D IC package; and
communicating the transmission signal from the second coil to an antenna on the second IC chip.

2. The method of claim 1 , further comprising filtering the transmission signal received from the second coil prior to supplying the signal to the antenna, thereby supplying a filtered transmission signal to the antenna.

3. The method of claim 2 , wherein filtering the transmission signal filters signals outside of the millimeter wave band.

4. The method of claim 1 , further comprising processing the transmission signal for transmission, wherein processing includes:
mixing a received intermediate frequency automatic gain control signal and a local oscillation signal at a mixer to form a mixed signal; and
amplifying the mixed signal at a power amplifier to form the transmission signal.

5. A method of receiving a signal from an antenna at an amplifier circuit utilizing through-chip coupling, the method comprising:
at a first coil on a first integrated circuit (IC) chip of a three-dimensional (3D) IC package, receiving a reception signal from an antenna;
wirelessly communicating the reception signal from the first coil to a second coil on a second IC chip of the 3D IC package, wherein the first coil and the second coil are not in direct contact, and wherein the first coil and the second coil vertically overlap, and wherein the first IC chip and the second IC chip are bonded to form the 3D IC package; and
communicating the reception signal to a processing circuit on the second IC chip.

6. The method of claim 5 , further comprising filtering the reception signal received from the antenna prior to supplying the signal to the first coil, thereby supplying a filtered reception signal to the first coil.

7. The method of claim 6 , wherein filtering the reception signal filters signals outside of the millimeter wave band.

8. The method of claim 5 , further comprising processing the reception signal upon reception, wherein processing includes:
communicating the reception signal to a low noise amplifier;
amplifying the reception signal at the low noise amplifier to form an amplified signal;
mixing the amplified signal and a local oscillation signal at a mixer to form a mixed signal; and
processing the mixed signal at an intermediate frequency automatic gain control circuit to form a processed signal.

9. An interface for through-chip coupling of an antenna and an analog amplifier circuit, the interface comprising:
a first coil on a first integrated circuit (IC) chip, wherein the first coil is coupled to an antenna; and
a second coil on a second IC chip, wherein the second coil is not in direct contact with the first coil, wherein the second coil is coupled to a first amplifier circuit, and wherein the first coil and the second coil are wirelessly communicable with each other to communicatively transmit signals between the antenna and the first amplifier circuit,
wherein the first coil and the second coil vertically overlap, and
wherein the first chip and the second chip define a three-dimensional (3D) IC package, and wherein the first IC chip and the second IC chip are bonded to form the 3D IC package.

10. The interface of claim 9 , further comprising a band-pass filter coupled between the antenna and the first coil.

11. The interface of claim 10 , wherein the first amplifier circuit includes a power amplifier.

12. The interface of claim 11 , further comprising:
a local oscillation circuit;
an intermediate frequency automatic gain control circuit; and
a mixer configured to receive signals from the local oscillation circuit and the intermediate frequency automatic gain control circuit to form a mixed output and further configured to supply the mixed output to the power amplifier.

13. The interface of claim 10 , wherein the first amplifier circuit includes a low noise amplifier.

14. The interface of claim 13 , further comprising:
a local oscillation circuit;
a mixer configured to receive signals from the local oscillation circuit and the low noise amplifier to form a mixed output; and
an intermediate frequency automatic gain control circuit configured to receive the mixed output from the mixer.

15. The interface of claim 9 , wherein the first amplifier circuit is configured to operate a circuit in the millimeter wave band.

16. The interface of claim 15 , wherein the first amplifier circuit is configured to operate over a bandwidth range of the millimeter wave band so as to reduce the inductance between the first coil and the second coil.

17. The interface of claim 15 , wherein the first amplifier circuit is configured to operate between about 30 GHz and about 100 GHz.

18. The interface of claim 15 , wherein the first amplifier circuit is configured to operate between about 60 GHz and about 70 GHz.

19. The interface of claim 9 , wherein the second coil is coupled to a second amplifier circuit, whereby the first amplifier circuit and the second amplifier circuit are configured to enable both reception and transmission of signals.

20. The interface of claim 9 , wherein the first coil and the second coil are axially aligned about a common axis.

21. The interface of claim 9 , wherein each of the first chip and the second chip includes a semiconductor material.

22. The interface of claim 21 , wherein the semiconductor material comprises at least one of silicon, germanium, or gallium.

Assignees

• Yeh Tzu-Jin
• Hsieh Hsieh-Hung
• Jin Jun-De
• Tsai Ming Hsien
• Jou Chewn-Pu
• Hsueh Fu-Lung
• Taiwan Semiconductor Mfg

Inventors

• Yeh Tzu-Jin
• Hsieh Hsieh-Hung
• Jin Jun-De
• Tsai Ming Hsien
• Jou Chewn-Pu
• Hsueh Fu-Lung

Classifications

• H04B5/0081 Primary

  Electricity · mapped topic

• H04B5/26 Primary

  using coils · CPC title