Through chip coupling for signal transport
US-9397729-B2 · Jul 19, 2016 · US
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Hsieh Hsieh-Hung patents
Hsieh Hsieh-Hung holds 5 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 5 |
| Recent patents | 0 |
| First publication | Feb 17, 2015 |
| Latest publication | Jul 19, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
System and method for inductive wireless signaling
US-9177715-B2 · Nov 3, 2015 · US
Electromagnetic bandgap structure for three dimensional ics
US-2015311159-A1 · Oct 29, 2015 · US
RF calibration through-chip inductive coupling
US-9129940-B2 · Sep 8, 2015 · US
ESD block isolation by RF choke
US-8958185-B2 · Feb 17, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Through chip coupling for signal transport
US-9397729-B2 · Jul 19, 2016 · US
System and method for inductive wireless signaling
US-9177715-B2 · Nov 3, 2015 · US
Electromagnetic bandgap structure for three dimensional ics
US-2015311159-A1 · Oct 29, 2015 · US
RF calibration through-chip inductive coupling
US-9129940-B2 · Sep 8, 2015 · US
ESD block isolation by RF choke
US-8958185-B2 · Feb 17, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/00 | 2 |
| H01L25/0657 | 2 |
| H04B5/0081 | 1 |
| H04B5/26 | 1 |
| H10W90/293 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 5 |