Process sheet resistance uniformity improvement using multiple melt laser exposures

Patent metadata

Field	Value
Publication number	US-9390926-B2
Application number	US-201414159228-A
Country	US
Kind code	B2
Filing date	Jan 20, 2014
Priority date	Mar 11, 2013
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser thermal treatment of semiconductor substrates by increasing the uniformity of energy distribution in an image at a surface of a substrate.

First claim

The invention claimed is:

1. A method of thermally processing a substrate, comprising:
positioning a substrate at a first position;
identifying a treatment zone of the substrate;
directing a first pulse of annealing energy through an aperture member at a second position to the treatment zone;
moving the substrate to a third position different from the first position;
moving the aperture member to a fourth position different from the second position, wherein the second position and the fourth position are located within a focal plane of the annealing energy; and
directing a second pulse of annealing energy through the aperture member at the fourth position to the treatment zone.

2. The method of claim 1 , wherein the substrate is moved in a first direction during the moving the substrate to the third position.

3. The method of claim 2 , wherein the aperture member is moved in a second direction during the moving the aperture member to the fourth position.

4. The method of claim 3 , wherein the second direction is opposite the first direction.

5. The method of claim 1 , wherein the moving the substrate to the third position and the moving the aperture member to the fourth position are performed simultaneously.

6. The method of claim 1 , wherein the moving the substrate to the third position and the moving the aperture member to the fourth position are performed consecutively.

7. The method of claim 1 , wherein the treatment zone is exposed to a first energy profile during the first pulse of annealing energy and a second energy profile during the second pulse of annealing energy, the first energy profile and the second energy profile having different speckle patterns.

8. The method of claim 1 , wherein an imaging optic is disposed within a propagation path of the annealing energy between the first and third positions and the second and fourth positions.

9. The method of claim 1 , wherein images at the first position and the third position are magnified at the second position and the fourth position.

10. A method of thermally processing a substrate, comprising:
positioning a substrate support at a first position in a propagation path of a laser;
positioning an aperture member at a second position in the propagation path of the laser, wherein imaging optics are positioned in the propagation path between the substrate support and the aperture member;
directing a first pulse of laser energy through the aperture member towards the substrate support;
moving the substrate support to a third position different from the first position;
moving the aperture member to a fourth position different from the second position, wherein the moving the substrate support and the moving the aperture member are of equal magnitude in opposite directions, and wherein the second position and the fourth position are located within a focal plane of the laser energy; and
directing a second pulse of laser energy through the aperture member towards the substrate support.

11. The method of claim 10 , wherein the moving the substrate support and the moving the aperture member are performed simultaneously.

12. The method of claim 10 , wherein the moving the substrate support and the moving the aperture member are performed consecutively.

13. The method of claim 10 , wherein the substrate support and the aperture member are moved in directions perpendicular to the propagation path of the laser.

14. The method of claim 10 , wherein a laser image at the second position has a first speckle pattern different than a second speckle pattern of the laser image at the fourth position.

15. A method of thermally processing a substrate, comprising:
generating a first laser pulse;
directing the first laser pulse through an aperture member disposed within a focal plane of the first laser pulse to define a first image with a first speckle pattern;
directing the first laser pulse through imaging optics;
positioning a treatment zone of a substrate to receive the first image;
stopping generation of the first laser pulse;
moving the aperture member a first magnitude in a first direction;
moving the substrate the first magnitude in a second direction opposite the first direction;
generating a second laser pulse;
directing the second laser pulse through the aperture member disposed within a focal plane of the second laser pulse to define a second image with a second pattern different from the first speckle pattern; and
directing the second laser pulse through the imaging optics, wherein the treatment zone of the substrate is positioned to receive the second image.

16. The method of claim 15 , wherein the moving the aperture member and the moving the substrate are performed after stopping generation of the first laser pulse and before generation of the second laser pulse.

17. The method of claim 16 , wherein the moving the aperture member and the moving the substrate are performed simultaneously.

18. The method of claim 16 , wherein the moving the aperture member and the moving the substrate are performed consecutively.

Assignees

• Applied Materials Inc

Inventors

• Li Jiping
• Hunter Aaron Muir
• Adams Bruce E
• Vellore Kim
• Howells Samuel C
• Moffatt Stephen

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P34/42 Primary

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• B23K26/066

  by using masks · CPC title

• B23K26/0622

  by shaping pulses · CPC title