Single-use, permanently-sealable microvalve

Patent metadata

Field	Value
Publication number	US-9388916-B2
Application number	US-201113307665-A
Country	US
Kind code	B2
Filing date	Nov 30, 2011
Priority date	Nov 30, 2011
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

A microvalve device is provided that includes a through via located in an island structure supported on a thermally-insulating membrane supported by a frame. The through via is surrounded by a meltable sealing material. A heater element is positioned on the island structure for sealing the material over the through via by heating the sealing material.

First claim

What is claimed is:

1. A microvalve device comprising:
an island structure that includes a throughway located in the island structure supported on a thermally-insulating membrane supported by a frame, the throughway is surrounded by a meltable sealing material on the island structure, the meltable sealing material includes a hollow cylindrical shape that surrounds the throughway having an aspect ratio to ensure upon thermal actuation the meltable sealing material reflows into a toroid due to surface tension; and
a heater element that is positioned underneath the island structure for sealing the material over the throughway by heating the sealing material, the sealing material prohibits a wetting interaction with an outer surface of the island structure driving a seal to spread towards the throughway upon melting, wherein inner edges of the toroid meet to thereby plug the throughway.

2. The microvalve device of claim 1 , wherein the thermally-insulating membrane comprises silicon nitride or a multi-layer structure of silicon nitride and silicon oxide.

3. The microvalve device of claim 1 , wherein the island structure comprises silicon, silicon carbide, glass, or metal.

4. The microvalve device of claim 1 , wherein the island structure comprises a diameter between 2 mm and 3 mm.

5. The microvalve device of claim 1 , wherein the frame comprises silicon, silicon carbide, glass, or metal.

6. The microvalve device of claim 5 , wherein the frame comprises an inner diameter between 3 mm and 4 mm.

7. The microvalve device of claim 1 , wherein the meltable sealing material comprises indium, soldering materials, or thermoplastic polymers.

8. The microvalve device of claim 7 , wherein the meltable sealing material comprises an aspect ratio approximately equal to or greater than 1:1.

9. The microvalve device of claim 1 , wherein the heater element comprises a resistive heating element.

10. A method of forming a single-use microvalve structure comprising:
forming an island structure that includes a throughway located in the island structure supported on a thermally-insulating membrane supported by a frame, the throughway is surrounded by a meltable sealing material on the island structure, the meltable sealing material includes a hollow cylindrical shape that surrounds the throughway having an aspect ratio to ensure upon thermal actuation the meltable sealing material reflows into a toroid due to surface tension; and
positioning a heater element underneath the island structure for sealing the material over the throughway by heating the sealing material, the sealing material prohibits a wetting interaction with an outer surface of the island structure driving a seal to spread towards the throughway upon melting, wherein inner edges of the toroid meet to thereby plug the throughway.

11. The method of claim 10 , wherein the thermally-insulating membrane comprises silicon nitride or a multi-layer structure of silicon nitride and silicon oxide.

12. The method of claim 10 , wherein the island structure comprises silicon, silicon carbide, glass, or metal.

13. The method of claim 12 , wherein the island structure comprises a diameter between 2 mm and 3 mm.

14. The method of claim 10 , wherein the frame comprises silicon, silicon carbide, glass, or metal.

15. The method of claim 14 , wherein the frame comprises an inner diameter between 3 mm and 4 mm.

16. The method of claim 10 , wherein the meltable sealing material comprises indium, soldering materials, or thermoplastic polymers.

17. The method of claim 16 , wherein the meltable sealing material comprises an aspect ratio approximately equal to or greater than 1:1.

18. The method of claim 10 , wherein the heater elements comprises a resistive heating element.

Assignees

• Akinwande Akintunde I
• Livermore-Clifford Carol
• Schmidt Martin A
• Dighe Aalap S
• Velásquez-García Luis Fernando
• Massachusetts Inst Technology

Inventors

• Akinwande Akintunde I
• Livermore-Clifford Carol
• Schmidt Martin A
• Dighe Aalap S
• Velásquez-García Luis Fernando

Classifications

• F16K99/003 Primary

  Valves for single use only · CPC title

• F16K99/0044

  using thermo-electric means · CPC title

• Y10T29/49412

  with assembly, disassembly or composite article making · CPC title

• Y10T137/1812

  In fluid flow path · CPC title