Radio frequency semiconductor device package and method for manufacturing same, and radio frequency semiconductor device
US-9219017-B2 · Dec 22, 2015 · US
Active metal brazing material
US9375811B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9375811-B2 |
| Application number | US-201214110709-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 21, 2012 |
| Priority date | May 24, 2011 |
| Publication date | Jun 28, 2016 |
| Grant date | Jun 28, 2016 |
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- Title
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Abstract
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The present invention provides an active metal brazing material composed of a Ag—Cu—Ti—Sn alloy containing by weight 20 to 40% of Cu, 1.0 to 3.0% of Ti, 1.2 to 6.0% of Sn and the balance being Ag, and having a metallographic structure including a Sn—Ti or Cu—Ti intermetallic compound dispersed in a Ag—Cu alloy matrix, wherein the weight ratio Sn/Ti between Ti and Sn is 1.2 or more, and additionally the particle size of the intermetallic compound is 20 μm or less. The foregoing active metal brazing material improves the workability of the hitherto known Ag—Cu—Ti alloy active metal brazing material and enables a critical dimension processing with a high processing rate, and can be produced by melting and casting the foregoing Ag—Cu—Ti—Sn alloy, and by subsequently plastically working the cast at a working rate of 90% or more to make finer the intermetallic compound involved.
First claim
Opening claim text (preview).
What is claimed is: 1. An active metal brazing material comprising a Ag—Cu—Ti—Sn alloy including 20 to 40% by weight of Cu, 1.0 to 3.0% by weight of Ti, 1.2 to 6.0% by weight of Sn and the balance being Ag, the active metal brazing material having a metallographic structure including a Sn—Ti intermetallic compound and a Sn—Ti—Cu intermetallic compound, and optionally a Cu—Ti intermetallic compound, dispersed in a Ag—Cu alloy matrix, wherein the weight ratio Sn/Ti between Ti and Sn is 1.2 or more but 5.0 or less, and the particle sizes of the intermetallic compounds are all 20 μm or less. 2. A method for producing the active metal brazing material defined in claim 1 , comprising the steps of: melting and casting a Ag—Cu—Ti—Sn alloy including 20 to 40% by weight of Cu, 1.0 to 3.0% by weight of Ti, 1.2 to 6.0% by weight of Sn and the balance being Ag, and having a weight ratio Sn/Ti between Ti and Sn of 1.2 to 3.5 to form a cast; and subjecting the cast to plastic working at a working rate of 90% or more to rupture the intermetallic compound in the Ag—Cu—Ti—Sn alloy to a particle size of 20 μm or less.
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Classifications
consisting of metals or metal salts · CPC title
Alumina or aluminates · CPC title
Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance · CPC title
- B23K35/3006Primary
Ag as the principal constituent · CPC title
with copper as the next major constituent · CPC title
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- What does patent US9375811B2 cover?
- The present invention provides an active metal brazing material composed of a Ag—Cu—Ti—Sn alloy containing by weight 20 to 40% of Cu, 1.0 to 3.0% of Ti, 1.2 to 6.0% of Sn and the balance being Ag, and having a metallographic structure including a Sn—Ti or Cu—Ti intermetallic compound dispersed in a Ag—Cu alloy matrix, wherein the weight ratio Sn/Ti between Ti and Sn is 1.2 or more, and addition…
- Who is the assignee on this patent?
- Kishimoto Takaomi, Kashiwagi Kouzou, Sakaguchi Osamu, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification B23K35/3006. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jun 28 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).