Method for producing composite material
US-2024052186-A1 · Feb 15, 2024 · US
Bonding composition
US2015252060A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015252060-A1 |
| Application number | US-201314434901-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 3, 2013 |
| Priority date | Oct 12, 2012 |
| Publication date | Sep 10, 2015 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
To provide a bonding composition where high joint strength can be obtained due to joining at a comparatively low temperature and under a pressureless condition, and, that is also equipped with thermal resistance that is difficult to cause a reduction of joint strength due to decomposition, deterioration and/or the like of a resin component at the time of an increase of an operating temperature, and to provide a bonding composition particularly containing metallic particles. A bonding composition containing inorganic metallic particles and organic components including unsaturated hydrocarbon and amine with 4 to 7 of carbon number
First claim
Opening claim text (preview).
1 - 3 . (canceled) 4 . A bonding composition, comprising: inorganic metallic particles and organic components including unsaturated carboxylic acid and amine with 4 to 7 of carbon number. 5 . The bonding composition according to claim 4 , wherein the unsaturated carboxylic acid is ricinoleic acid.
Assignees
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Classifications
Die-attach connectors · CPC title
containing organic material comprising solvents, e.g. for slip casting · CPC title
Metallic powder coated with organic material · CPC title
Submicron particles having a size above 100 nm up to 300 nm · CPC title
Nanosized particles · CPC title
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- What does patent US2015252060A1 cover?
- To provide a bonding composition where high joint strength can be obtained due to joining at a comparatively low temperature and under a pressureless condition, and, that is also equipped with thermal resistance that is difficult to cause a reduction of joint strength due to decomposition, deterioration and/or the like of a resin component at the time of an increase of an operating temperature,…
- Who is the assignee on this patent?
- Bando Chemical Ind
- What technology area does this patent fall under?
- Primary CPC classification B22F9/24. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Sep 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).