Workpiece mounting apparatus

Patent metadata

Field	Value
Publication number	US-9374936-B2
Application number	US-201414306296-A
Country	US
Kind code	B2
Filing date	Jun 17, 2014
Priority date	Sep 3, 2011
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

A workpiece mounting apparatus includes a transfer apparatus having a nozzle, a first imaging unit, and an image processor. The nozzle has opposed first and second ends, a suction hole at the first end, and a transparent end face member sealing the second end. The first imaging unit captures a first pattern for positioning a workpiece. The image processor identifies a reference position of the workpiece based on the first pattern captured. The workpiece mounting apparatus also includes a substrate support supporting a substrate with a second pattern for positioning, a second imaging unit for capturing the second pattern, and a positioning unit for controlling position of the nozzle. The image processor identifies a mounting target position on the substrate, based on the second pattern capture, and the positioning unit controls the nozzle to mount the workpiece on the substrate, when the reference position coincides with the mounting target position.

First claim

What is claimed is:

1. A workpiece mounting apparatus comprising:
a workpiece transfer apparatus including
a nozzle unit including a tubular body having opposed first and second ends, a suction hole opening at the first end of the tubular body, and an end face member sealing the second end of the tubular body, wherein at least part of the end face member is transparent,
an imaging unit for capturing, through the end face member and the suction hole, an image of a first pattern for positioning of a workpiece, the first pattern being located on a surface of the workpiece that is held at the suction hole, and
an image processor for identifying a reference position of the workpiece based on an image including the first pattern for positioning that is captured by the first imaging unit;

a substrate support unit supporting a substrate which has a second pattern for positioning located on at least one side of the substrate, wherein the imaging unit captures an image including the second pattern for positioning of the substrate supported by the substrate support unit; and
a relative positioning unit for controlling relative position of the nozzle unit; wherein
the image processor identifies a mounting target position on the substrate, based on the image including the second pattern for positioning that is captured by the imaging unit, and
the relative positioning unit controls the nozzle unit to mount the workpiece on the substrate, when the reference position of the workpiece, identified by the first pattern for positioning, coincides with the mounting target position on the substrate.

Assignees

• Tdk Corp

Inventors

• Mizuno Toru
• Shindo Osamu
• Nakayama Hitoshi

Classifications

• H10W72/072

  of bump connectors · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W72/07178

  Means for aligning · CPC title

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title