Microphone Apparatus and Method To Provide Extremely High Acoustic Overload Points
US-2015208165-A1 · Jul 23, 2015 · US
US9374643B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9374643-B2 |
| Application number | US-201114354020-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 4, 2011 |
| Priority date | Nov 4, 2011 |
| Publication date | Jun 21, 2016 |
| Grant date | Jun 21, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A microphone base includes a plurality of metal layers and a plurality of core layers. Each of the plurality of core layers is disposed between selected ones of the metal layers. A dielectric membrane is disposed between other selected ones of the plurality of metal layers. A port extends through the metal layers and the core layers but not through the dielectric membrane. The dielectric membrane has a compressed portion and an uncompressed portion. The uncompressed portion extends across the port and the compressed portion is in contact with the other selected ones of the metal layers. The compressed portion of the membrane is effective to operate as a passive electronic component and the uncompressed portion is effective to act as a barrier to prevent at least some external debris from traversing through the port.
Opening claim text (preview).
What is claimed is: 1. A microphone base, the base comprising: a plurality of metal layers; a plurality of core layers, each of the plurality of core layers being disposed between selected ones of the metal layers; a dielectric membrane disposed between other selected ones of the plurality of metal layers; a port that extends through the metal layers and the core layers but not through the dielectric membrane; such that the dielectric membrane has a compressed portion and an uncompressed portion, the uncompressed portion extending across the port and the compressed portion being in contact with the other selected ones of the metal layers; such that the compressed portion of the membrane is effective to operate as a passive electronic component and the uncompressed portion is effective to act as a barrier to prevent at least some external debris from traversing through the port. 2. The base of claim 1 wherein the dielectric constant value of the compressed portion is different than the dielectric constant value of the uncompressed portion. 3. The base of claim 1 wherein the membrane comprises an expanded Teflon expanded polytetrafluoroethylene (ePTFE) film. 4. The base of claim 1 wherein the electronic component comprises a capacitor. 5. The base of claim 1 wherein the port has a diameter greater than approximately 1.0 mm. 6. A microphone comprising: a base, the base comprising: a plurality of metal layers; a plurality of core layers, each of the plurality of core layers being disposed between selected ones of the metal layers; a dielectric membrane disposed between other selected ones of the plurality of metal layers; a port that extends through the metal layers and the core layers but not through the dielectric membrane; such that the dielectric membrane has a compressed portion and an uncompressed portion, the uncompressed portion extending across the port and the compressed portion being in contact with the other selected ones of the metal layers; such that the compressed portion of the membrane is effective to operate as a passive electronic component and the uncompressed portion of the membrane is effective to act as a barrier to prevent at least some external debris from traversing through the port; a transducer disposed over and coupled to the base and communicating with the port, the transducer configured to covert sound energy received from the port into electrical energy. 7. The microphone of claim 6 further comprising a cover attaching to the base, the cover covering the transducer. 8. The microphone of claim 6 further comprising an amplifier coupled to the transducer. 9. The microphone of claim 6 wherein the dielectric constant value of the compressed portion is different than the dielectric constant value of the uncompressed portion. 10. The microphone of claim 6 wherein the membrane comprises an expanded Teflon expanded polytetrafluoroethylene (ePTFE) film. 11. The microphone of claim 6 wherein the electronic component comprises a capacitor. 12. The microphone of claim 6 wherein the port has a diameter greater than approximately 1.0 mm.
comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title
between laterally-adjacent chips · CPC title
next to a particulate layer · CPC title
Polyolefin particles, e.g. polyethylene or polypropylene homopolymers or ethylene-propylene copolymers · CPC title
using semiconductor materials · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.