Embedded circuit in a MEMS device

Patent metadata

Field	Value
Publication number	US-8995694-B2
Application number	US-201313755417-A
Country	US
Kind code	B2
Filing date	Jan 31, 2013
Priority date	Feb 1, 2012
Publication date	Mar 31, 2015
Grant date	Mar 31, 2015

Abstract

A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die is disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output signal. The output signals of the integrated circuit are routed directly into at least one conductor to access pads at the printed circuit board and the access pads are disposed on a bottom surface of the printed circuit board that is opposite the top surface.

First claim

What is claimed is:

1. A Microelectromechanical System (MEMS) microphone, comprising:
a printed circuit board, the printed circuit board having a first metal layer, a second metal layer, and at least one plated through hole via, the first metal layer and the second metal layer electrically coupled to opposing end portions of the at least one plated through hole via;
a MEMS die disposed on a top surface of the printed circuit board;
an integrated circuit having a surface facing the first metal layer, the integrated circuit disposed within the printed circuit board and between the first metal layer and the second metal layer, the integrated circuit producing at least one output signal; and
such that the at least one output signal of the integrated circuit is routed directly from the top surface of the integrated circuit to the first metal layer of the printed circuit board, to the at least one plated through hole via, to the second metal layer, and then to access pads at the printed circuit board, the access pads being disposed on a bottom surface of the printed circuit board that is opposite the top surface and being electrically coupled to the second metal layer.

2. The MEMS microphone of claim 1 wherein the MEMS die is mounted to the top surface of the PCB and a lid is adhered to the top surface of the PCB to acoustically seal and protect the MEMS device from external environmental elements.

3. The MEMS microphone of claim 2 wherein a port extends through the lid.

4. The MEMS microphone of claim 1 wherein a port extends through the printed circuit board.

5. The MEMS microphone of claim 1 wherein a back volume is disposed between the printed circuit board and the MEMS die.

6. The MEMS microphone of claim 1 wherein the integrated circuit is disposed partially under the MEMS die.

7. The MEMS microphone of claim 1 wherein the integrated circuit is disposed completely under the MEMS die.

8. The MEMS microphone of claim 1 wherein the integrated circuit is an application specific integrated circuit (ASIC).

9. The MEMS microphone of claim 1 wherein the integrated circuit includes conductive pads and an interface layer is disposed between the conductive pads of the integrated circuit and the printed circuit board.

10. The MEMS microphone of claim 9 wherein the interface layer comprises an insulating layer.

Assignees

• Knowles Electronics Llc

Inventors

• Vos Sandra F
• Giesecke Daniel

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title