Polymer member based interconnect

Patent metadata

Field	Value
Publication number	US-9373585-B2
Application number	US-201414489358-A
Country	US
Kind code	B2
Filing date	Sep 17, 2014
Priority date	Sep 17, 2014
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

An interconnect ( 124 ) suitable for attachment of integrated circuit assemblies to each other comprises a polymer member ( 130 ), possibly dielectric, coated with a conductive material ( 144 ) which provides one or more conductive lines. In some embodiments, the conductive material covers a part, but not all, of the polymer member. In some embodiments, multiple conductive lines are formed on the polymer member. In some embodiments, the polymer member is conductive. Such interconnects replace metal bond wires in some embodiments. Other features are also provided.

First claim

The invention claimed is:

1. A first structure comprising:
a substrate comprising a top surface and comprising circuitry with one or more contact pads at the top surface;
a first microelectronic component disposed on a first region of the substrate;
a plurality of first members disposed on a second region of the substrate, each first member comprising a dielectric core comprising one or more polymers, each first member also comprising a plurality of conductive lines each of which extends on a sidewall surface of the dielectric core of the first member and extends from the second region of the substrate to a top of the first member, each conductive line being electrically connected to at least one said contact pad; and
wherein each conductive line comprises one or more contact pads for connecting the corresponding first member to one or more second microelectronic components.

2. The first structure of claim 1 , wherein the first region comprises one or more of said contact pads at the top surface of the substrate.

3. The first structure of claim 1 , wherein for at least one first member, at least two of the conductive lines extending on the sidewall surface of the core of the first member are electrically isolated from one another.

4. The first structure of claim 3 , wherein for said at least one first member, at least one of the at least two conductive lines is coupled to a power source, a data signal terminal, or ground and at least one other of the at least two conductive lines is coupled to a different power source, a data signal source, or ground.

5. The first structure of claim 1 , wherein at least one conductive line extends on the sidewall surfaces of at least two first members sharing the conductive line.

6. The first structure of claim 1 , wherein the one or more polymers comprise a plastic or a photosensitive material.

7. The first structure of claim 1 , further comprising a continuous dielectric layer that encapsulates each conductive line along at least part of a length of each conductive line.

8. The first structure of claim 1 , wherein at least one conductive line provides at least part of a conductive path interconnecting at least two microelectronic components, at least two circuit components, or a combination of circuit components and microelectronic components.

9. The first structure of claim 7 wherein the conductive lines protrude out of the continuous dielectric layer.

10. A structure comprising:
a plurality of electrically conductive interconnects, each interconnect comprising a dielectric member comprising one or more polymers and extending along the interconnect, the dielectric member comprising a first area at a bottom of the interconnect, a second area at a top of the interconnect, and a sidewall surface between the first and second areas, the interconnect comprising one or more electrically conductive lines on the sidewall surface that cover a part, but not all, of the sidewall surface, each conductive line extending from the first area to the second area;
a continuous dielectric layer that laterally encapsulates each said interconnect along at least a part of the length of the interconnect but does not cover top and bottom ends of each said conductive line to allow the conductive lines to be attached to circuitry which is not part of the structure, the continuous dielectric layer physically contacting the sidewall surface of each said dielectric member.

11. The structure of claim 10 , wherein in at least one interconnect, the dielectric member has a length measured as a distance between the first and second areas, the length being greater than a width of the dielectric member.

12. The structure of claim 10 , wherein at least one electrically conductive line of at least one interconnect is attached to a contact pad of an integrated circuit or an interconnect substrate.

13. The structure of claim 10 , wherein each said electrically conductive line comprises one or more of metal, doped polysilicon, or carbon.

14. The structure of claim 10 , wherein the one or more polymers comprise a plastic or a photosensitive material.

15. The structure of claim 10 , wherein at least one interconnect is for transmitting power, ground, data and neutral signals.

16. The structure of claim 10 further comprising one or more microelectronic components each of which comprises an integrated circuit or an interconnect substrate;
wherein the continuous dielectric layer laterally encapsulates each said microelectronic component.

17. The structure of claim 10 wherein each end of each conductive line is attached to an integrated circuit or an interconnect substrate.

18. The structure of claim 10 wherein at least one interconnect comprises at least two of the conductive lines.

19. The structure of claim 18 wherein said at least two of the conductive lines do not meet but are spaced from each other.

20. The structure of claim 10 wherein for at least one dielectric member, at least one of the corresponding conductive lines is thicker than at least one other one of the corresponding conductive lines.

21. The structure of claim 10 wherein at least one dielectric member is a polygon, and at least two of the corresponding conductive lines are formed on respective different sides of the polygon.

22. The structure of claim 10 wherein at least two dielectric members share at least one said conductive line disposed on the sidewall surfaces of the at least two dielectric members.

23. The first structure of claim 1 wherein for at least one dielectric core, at least one of the corresponding conductive lines is thicker on the sidewall surface of the dielectric core than at least one other one of the corresponding conductive lines.

24. The first structure of claim 1 wherein at least one dielectric core is a polygon, and at least two of the corresponding conductive lines extend on respective different sides of the polygon.

Assignees

• Invensas Corp

Inventors

• Uzoh Cyprian Emeka
• Katkar Rajesh
• Woychik Charles G
• Gao Guilian
• Sitaram Arkalgud R

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W72/879

  Bump connectors and bond wires · CPC title

• H10W72/856

  Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15) · CPC title