Method of forming dual size microlenses for image sensors

Patent metadata

Field	Value
Publication number	US-9372286-B2
Application number	US-201313860859-A
Country	US
Kind code	B2
Filing date	Apr 11, 2013
Priority date	Apr 11, 2013
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

A method of forming microlenses for an image sensor having at least one large-area pixel and at least one small-area pixel is disclosed. The method includes forming a uniform layer of microlens material on a light incident side of the image sensor over the large-area pixel and over the small-area pixel. The method also includes forming the layer of microlens material into a first block disposed over the large-area pixel and into a second block disposed over the small-area pixel. A void is also formed in the second block to reduce a volume of microlens material included in the second block. The first and second blocks are then reflowed to form a respective first microlens and second microlens. The first microlens has substantially the same effective focal length as the second microlens.

First claim

What is claimed is:

1. A method of forming microlenses for an image sensor having at least one large-area pixel and at least one small-area pixel, the method comprising:
forming a uniform layer of microlens material on a light incident side of the image sensor over the at least one large-area pixel and over the at least one small-area pixel;
forming the layer of microlens material into a first block disposed over the at least one large-area pixel and into a second block disposed over the at least one small-area pixel;
forming at least one void in the second block to reduce a volume of microlens material included in the second block; and
reflowing the first block and the second block to form a respective first microlens and second microlens, wherein the first microlens has substantially the same effective focal length as the second microlens.

2. The method of claim 1 , wherein the at least one void is formed at the same time and during the same processing step used to form the layer of microlens material into the first and second blocks.

3. The method of claim 1 , wherein the at least one void extends completely through from a top side to a bottom side of the second block of microlens material.

4. The method of claim 1 , wherein the first block of microlens material has a height that is substantially the same as a height of the second block and wherein a width of the first block is greater than a width of the second block.

5. The method of claim 1 , wherein forming the uniform layer of microlens material includes applying a uniform layer of photoresist material on the light incident side of the image sensor over the at least one large-area pixel and over the at least one small-area pixel.

6. The method of claim 5 , wherein forming the layer of microlens material into the first and second blocks includes exposing the layer of photoresist material to a pattern of light and developing the exposed layer to form a gap in the photoresist material between the at least one large-area pixel and the at least one small-area pixel.

7. The method of claim 6 , wherein the exposing of the layer of photoresist material and developing the exposed layer includes exposing the layer of photoresist material and developing the exposed layer to simultaneously form the gap and the at least one void in the second block.

8. The method of claim 7 , wherein the pattern of light used to expose the photoresist material is formed by a grayscale photomask, such that the gap extends completely through from a top side to a bottom side of the photoresist material and the at least one void does not extend completely through the photoresist material.

9. The method of claim 1 , wherein the microlens material comprises a transparent thermoplastic.

10. The method of claim 9 , wherein the transparent thermoplastic comprises Polymethyl Methacrylate (PMMA).

11. The method of claim 1 , further comprising:
applying a layer of photoresist material over the microlens material;
exposing the layer of photoresist material to a pattern of light; and
developing the exposed layer of photoresist material,
wherein forming the layer of microlens material into the first and second blocks includes etching the microlens material using the exposed and developed layer of photoresist material as an etch stop to form a gap in the microlens material between the at least one large-area pixel and the at least one small-area pixel.

12. The method of claim 11 , wherein etching the microlens material using the exposed and developed layer of photoresist material as an etch stop includes etching the microlens material to simultaneously form the gap and the at least one void in the second block.

13. The method of claim 1 , wherein the image sensor is a complementary metal oxide semiconductor (CMOS) image sensor.

14. A method of forming microlenses for a complementary metal oxide semiconductor (CMOS) image sensor having at least one large-area pixel and at least one small-area pixel, the method comprising:
applying a uniform layer of photoresist material on a light incident side of the image sensor over the at least one large-area pixel and over the at least one small-area pixel;
exposing the layer of photoresist material to a pattern of light and developing the exposed layer to simultaneously:
form the photoresist material into a first block disposed over the at least one large area pixel and into a second block disposed over the at least one small area pixel; and
form at least one void in the second block to reduce a volume of the photoresist material included in the second block; and
reflowing the first block and second block of photoresist material to form a respective first microlens and second microlens, wherein the first microlens has substantially the same effective focal length as the second microlens.

15. The method of claim 14 , wherein the at least one void extends completely through from a top side to a bottom side of the second block of photoresist material.

16. The method of claim 14 , wherein the first block of photoresist material has a height that is substantially the same as a height of the second block and wherein a width of the first block is greater than a width of the second block.

17. The method of claim 14 , wherein forming the photoresist material into the first block disposed over the at least one large area pixel and into the second block disposed over the at least one small area pixel includes forming a gap in the photoresist material between the at least one large-area pixel and the at least one small area pixel.

18. The method of claim 17 , wherein the pattern of light used to expose the photoresist material is formed by a grayscale photomask, such that the gap extends completely through from a top side to a bottom side of the photoresist material and the at least one void does not extend completely through the photoresist material.

19. The method of claim 14 , wherein the photoresist material comprises a transparent thermoplastic.

20. The method of claim 16 , wherein the transparent thermoplastic comprises Polymethyl Methacrylate (PMMA).

Assignees

• Omnivision Tech Inc

Inventors

• Li Jin
• Chen Gang
• Qian Yin
• Tai Hsin-Chih

Classifications

• B29D11/00384

  Local shaping by heating, e.g. local irradiation causing expansion · CPC title

• B29D11/00451

  Changing a shape by remelting · CPC title

• G02B3/0043

  Inhomogeneous or irregular arrays, e.g. varying shape, size, height · CPC title

• B29D11/00365

  Production of microlenses (lenticular sheets B29D11/00278) · CPC title

• G02B3/0018 Primary

  Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching · CPC title