Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching

Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching · Cooperative Patent Classification (CPC)

Computing, optics, measurement, and control technologies.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeG02B3/0018
Official title{Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching}
Display labelReflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
Total patents138

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is growing.

Patents filed per year
YearPatents
201512
201617
20177
20187
201914
202012
20219
202222
20239
202412
202517

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC G02B3/0018?
CPC G02B3/0018 is the Cooperative Patent Classification code for “Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching.”
How many patents are filed under CPC G02B3/0018 (Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching)?
Our database includes 138 publications tagged with this CPC code.
Is patent activity under CPC G02B3/0018 growing?
Publication counts under this code: 12 in 2024 vs 17 in 2025 (latest complete years).