Injection molded microoptics

Patent metadata

Field	Value
Publication number	US-9490408-B2
Application number	US-201314026598-A
Country	US
Kind code	B2
Filing date	Sep 13, 2013
Priority date	Aug 2, 2005
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

First claim

What is claimed is:

1. An apparatus comprising:
a substrate containing semiconductor devices, and
a plurality of molded, spectrally absorptive microoptic elements positioned on and extending above said substrate and spaced apart from one another by a predetermined distance and aligned with respect to said substrate to couple radiant energy to a plurality of said semiconductor devices,
each of said molded microoptic elements comprising optical polymers or glasses having a specified molded shaped surface design and including a color absorbing filter integrated into the optical polymers or glasses of the each molded microoptic element to form a spectrally absorptive microlens, wherein said each molded microoptic element transmits only a selected color of light, and each of said molded microoptic elements having a radius of curvature and a focal length for semiconductor color imaging with said plurality of said semiconductor devices.

2. The apparatus of claim 1 wherein said microoptic elements are less than 10 micrometers in one dimension.

3. The apparatus of claim 1 wherein said microoptic elements are less than 1 micrometer in one dimension.

4. The apparatus of claim 1 wherein a plurality of said microelements contain polymers having different indices of refraction.

5. The apparatus of claim 1 further including a plurality of C4 solder bumps positioned on said substrate and spaced apart from one another by a predetermined distance and aligned with respect to said substrate to couple electrical signals to a plurality of said semiconductor devices.

6. The apparatus according to claim 1 , wherein the molded microoptic elements comprise liquid crystal materials formed into an active lens array with electronically variable focal length and depth of focus.

7. The apparatus according to claim 6 , wherein:
the molded microoptic elements comprise injected molded microoptic elements and are aspheric;
the color absorbing filters comprise an array of color filters integrated into the microoptic elements; and
said specified molded shaped surface design includes a molded shaped upper surface of the molded microoptic elements positioned above said substrate.

8. The apparatus according to claim 6 , further comprising an interface layer between the semiconductor device and the molded microoptic elements providing planarization, refractive index matching to reduce interfacial reflection loss, and adhesion of the molded microoptic elements.

9. The apparatus according to claim 1 , further including solder interconnects molded onto the substrate for making electrical contacts to a packaging substrate.

10. The apparatus according to claim 1 , wherein the plurality of molded microoptic elements comprise a single layer of aspheric microlenses.

11. The apparatus according to claim 1 , wherein the molded microoptic elements further comprises photoiniators and photoreactive agents.

Assignees

• IBM

Inventors

• Jacobowitz Lawrence
• Buchwalter Stephen
• Decusatis Casimer
• Gruber Peter A
• Shih Da-Yuan

Classifications

• B29D11/00365

  Production of microlenses (lenticular sheets B29D11/00278) · CPC title

• G02F1/137

  characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering · CPC title

• B29D11/00461

  Adjusting the refractive index, e.g. after implanting · CPC title

• G02B3/0056

  arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses (G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085) · CPC title

• B82Y30/00

  Nanotechnology for materials or surface science, e.g. nanocomposites · CPC title