Light-emitting device

Patent metadata

Field	Value
Publication number	US-9360204-B2
Application number	US-201414257948-A
Country	US
Kind code	B2
Filing date	Apr 21, 2014
Priority date	Oct 27, 2011
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A light-emitting device includes a light-emitting element and a wavelength conversion layer. The light-emitting device further includes the translucent member having a translucent base and the wavelength conversion layer formed on the translucent base. The wavelength conversion layer does not contact the light-emitting element, and is sealed in the light-emitting device.

First claim

What is claimed is:

1. A light-emitting device including a light-emitting element and a wavelength conversion layer, comprising:
a translucent member including:
a translucent base, and
the wavelength conversion layer formed on the translucent base, and

a frame body formed with a recess,
wherein the wavelength conversion layer does not contact the light-emitting element, and is sealed in the light-emitting device,
the light-emitting element is mounted in the recess,
the translucent member is mounted on the frame body so as to cover the recess,
the translucent member is bonded to the frame body with an adhesive material,
a side surface of the wavelength conversion layer is covered by the adhesive material, and
a cutout is formed in an end part of the translucent base.

2. The light-emitting device of claim 1 , wherein the wavelength conversion layer contains semiconductor fluorescent particles.

3. The light-emitting device of claim 1 , wherein the cutout is filled with the adhesive material.

4. The light-emitting device of claim 1 , wherein the wavelength conversion layer contacts an upper surface of the frame body.

5. The light-emitting device of claim 1 , wherein the recess is filled with gas other than oxygen.

6. A light-emitting device including a light-emitting element and a wavelength conversion layer, comprising:
a translucent member including:
a translucent base, and
the wavelength conversion layer formed on the translucent base,

wherein the wavelength conversion layer does not contact the light-emitting element, and is sealed in the light-emitting device,
the translucent member includes a barrier layer,
the barrier layer is formed on a side of the wavelength conversion layer opposite to the translucent base,
the wavelength conversion layer is sealed with the translucent base and the barrier layer,
the translucent base is a translucent circuit board, and
the light-emitting element is electrically connected to an interconnection formed on the translucent base.

7. The light-emitting device of claim 6 , wherein
a through-hole is formed in the translucent base,
the through-hole is filled with the wavelength conversion layer, and
a heat dissipation pattern is formed on the translucent base so as to cover the through-hole.

8. The light-emitting device of claim 6 , wherein a cured layer is formed at a side surface of the wavelength conversion layer.

9. A light-emitting device including a light-emitting element and a wavelength conversion layer, comprising:
a translucent member including:
a translucent base, and
the wavelength conversion layer formed on the translucent base,

wherein the wavelength conversion layer does not contact the light-emitting element, and is sealed in the light-emitting device,
the translucent member includes a barrier layer,
the barrier layer is formed on a side of the wavelength conversion layer opposite to the translucent base,
the wavelength conversion layer is sealed with the translucent base and the barrier layer,
the light-emitting element is bonded to the translucent member, and
a side surface of the light-emitting element and a side surface of the translucent member are flush with each other.

10. The light-emitting device of claim 9 , wherein a heat dissipation pattern is formed on the light-emitting element.

11. The light-emitting device of claim 9 , wherein a cured layer is formed at a side surface of the wavelength conversion layer.

Assignees

• Panasonic Corp

Inventors

• Fukuda Toshiyuki
• Harada Yutaka
• Ohsaki Hiroto
• Fujii Toshio

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/522

  Multilayered bond wires, e.g. having a coating concentric around a core · CPC title

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W76/63

  characterised by their shape or disposition, e.g. between cap and walls of a container · CPC title