Polishing system with front side pressure control

Patent metadata

Field	Value
Publication number	US-9358658-B2
Application number	US-201414213842-A
Country	US
Kind code	B2
Filing date	Mar 14, 2014
Priority date	Mar 15, 2013
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

First claim

What is claimed is:

1. A polishing apparatus, comprising:
a platen rotatable about an axis of rotation, the platen including a first surface to support a polishing pad, a second surface on a side of the platen opposite the first surface, and a plurality of through-holes defined in the platen extending from the first surface to the second surface, the through-holes having input ends at the second surface and output ends at the first surface;
a carrier head to hold a substrate against the polishing pad; and
a pad pressure control assembly including a body positioned on the side of the platen opposite the carrier head and having a third surface adjacent and parallel to the second surface, the pad pressure control assembly further including a plurality of channels through the body, the plurality of channels connected to a fluid source and having outlets on the third surface of the body, the body of the pad pressure control assembly laterally movable relative to the axis of rotation of the platen such that the outlets on the third surface move laterally relative to the through-holes in the platen, and wherein the third surface is positioned relative to the second surface such that in operation the outlets of the channels in the body are fluidically coupled to the input ends of the through-holes in the platen and a through-hole to which a particular outlet is fluidically coupled changes as the body moves laterally relative to the platen.

2. The polishing apparatus of claim 1 wherein the pad pressure control assembly comprises a fluid pressure control assembly to independently control pressure of fluid applied through at least some of the plurality of channels.

3. The polishing apparatus of claim 1 , comprising a fluid pressure control assembly configured to direct fluid through the fluid channels at sufficient pressure to press on the polishing pad supported on the first surface and deform a portion of the polishing pad that is positioned above the through-hole.

4. The polishing apparatus of claim 1 , further comprising a bearing ring surrounding the body to seal an interface between the body and the platen.

5. The polishing apparatus of claim 4 , wherein the bearing ring comprises a contact bearing ring to contact a bottom surface of the platen.

6. The polishing apparatus of claim 4 , wherein the bearing ring comprises a fluid bearing ring to maintain a gap from a bottom surface of the platen.

7. The polishing apparatus of claim 4 , wherein the fluid bearing ring is configured to adjust the distance between the body of the pad pressure control assembly and the second surface of the platen.

8. The polishing apparatus of claim 4 , further comprising a linear rail which supports the body and along which the body can move in a first direction in a plane parallel to the first surface of the platen, the plane being a first distance away from the platen.

9. The polishing apparatus of claim 8 , a second linear rail which supports the body and along which the body can move in a plane parallel to the first surface of the platen in a second direction perpendicular to the first direction.

10. The polishing apparatus of claim 1 , comprising a first actuator coupled to the body to cause the body to move laterally relative to the axis of rotation of the platen.

11. The polishing apparatus of claim 10 , comprising a second actuator coupled to the carrier head to cause the carrier head to move laterally relative to the axis of rotation of the platen.

12. The polishing apparatus of claim 11 , comprising a controller coupled to the first actuator and the second actuator to coordinate motion of the body and the carrier head such that the body remains substantially aligned with the carrier head.

13. The polishing apparatus of claim 2 , wherein the body comprises a plurality of zones, each zone including a different group of channels out of the plurality of channels, and wherein the fluid pressure control assembly is configured to independently control pressure of fluid in each zone.

14. The polishing apparatus of claim 13 , wherein the plurality of zones are concentric.

15. The polishing apparatus of claim 1 , wherein the polishing pad is fixed relative to the platen.

16. The polishing apparatus of claim 15 , wherein the polishing pad is adhesively attached to the first surface.

17. A method of polishing, comprising:
supporting a polishing pad on a first surface of platen, the platen having a first surface to support the polishing pad;
holding a substrate in a carrier head with a surface of the substrate against a top surface of the polishing pad;
applying a pressure on a bottom surface of the polishing pad from a plurality of through-holes defined in the platen by directing fluid through channels in a body positioned adjacent the platen on a side of the platen opposite the carrier head and from outlets of the channels in a third surface of the body into a plurality of through-holes in the platen that extend from a second surface of the platen on a side of the platen opposite the first surface to the first surface, and wherein the third surface is positioned parallel and relative to the second surface such that the outlets of the channels in the third surface of the body are fluidically coupled to the through-holes in the platen; and
moving the body laterally relative to the axis of rotation of the platen such that the outlets on the third surface move laterally relative to the through-holes in the platen and a through-hole to which a particular outlet is fluidically coupled changes as the body moves laterally relative to the platen.

Assignees

• Applied Materials Inc

Inventors

• Chang Shou-Sung
• Fujikawa Takashi
• Chen Hung Chih
• Butterfield Paul D

Classifications

• B24B37/10

  for single side lapping · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B37/32

  Retaining rings · CPC title

• B24B37/16

  characterised by the shape of the lapping plate surface, e.g. grooved · CPC title

• B24B49/16

  taking regard of the load · CPC title