Method And System For Photonic Interposer

Patent metadata

Field	Value
Publication number	US-2016277115-A1
Application number	US-201615165677-A
Country	US
Kind code	A1
Filing date	May 26, 2016
Priority date	Sep 8, 2008
Publication date	Sep 22, 2016
Grant date	—

Abstract

Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, either from an optical source assembly or from optical fibers coupled to the silicon photonic interposer. A modulated optical signal may be generated by processing the received CW optical signals based on a first electrical signal received from the electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, memory, or a router.

First claim

What is claimed is:

1 . A method for communication, the method comprising:
in an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer:
receiving one or more continuous wave (CW) optical signals in said silicon photonic interposer from an optical source external to said silicon photonic interposer;
generating a modulated optical signal in said silicon photonic interposer by processing said one or more received CW optical signals based on a first electrical signal received from one of said one or more CMOS electronics die;
generating a second electrical signal in said silicon photonic interposer based on said generated modulated optical signal; and
communicating said second electrical signal to another of said one or more CMOS electronics die.

2 . The method according to claim 1 , comprising communicating said second electrical signal to said another of said one or more CMOS electronics die via copper pillars.

3 . The method according to claim 1 , comprising receiving said one or more CW optical signals in said silicon photonic interposer from an optical source assembly coupled to said silicon photonic interposer.

4 . The method according to claim 1 , comprising receiving said one or more CW optical signals from one or more optical fibers coupled to said silicon photonic interposer.

5 . The method according to claim 1 , comprising processing said one or more received CW optical signals utilizing one or more optical modulators in said silicon photonic interposer.

6 . The method according to claim 5 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

7 . The method according to claim 1 , comprising generating said second electrical signal in said silicon photonic interposer a photodetector integrated in said silicon photonic interposer.

8 . The method according to claim 1 , wherein said one or more optical couplers on said silicon photonic interposer comprise grating couplers.

9 . The method according to claim 1 , wherein said one or more electronics die comprise one or more of: a processor core, a switch core, memory, or a router.

10 . The method according to claim 1 , wherein said integrated optical communication system comprises a plurality of transceivers.

11 . A system for communication, the system comprising:
an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to:
receive one or more continuous wave (CW) optical signals in said silicon photonic interposer from an optical source external to said silicon photonic interposer;
generate a modulated optical signal by processing said one or more received CW optical signals based on a first electrical signal received from one of said one or more CMOS electronics die;
generate a second electrical signal in said silicon photonic interposer based on said generated modulated optical signal; and
communicate said second electrical signal to another of said one or more CMOS electronics die.

12 . The system according to claim 11 , wherein said integrated optical communication system is operable to communicate said second electrical signal to said another of said one or more CMOS electronics die via copper pillars.

13 . The system according to claim 11 , wherein said hybrid integration optical communication system is operable to receive said one or more CW optical signals in said silicon photonic interposer from an optical source assembly coupled to said silicon photonic interposer.

14 . The system according to claim 11 , wherein said hybrid integration optical communication system is operable to receive said one or more CW optical signals from one or more optical fibers coupled to said silicon photonic interposer.

15 . The system according to claim 11 , wherein said hybrid integration optical communication system is operable to process said one or more received CW optical signals utilizing one or more optical modulators in said silicon photonic interposer.

16 . The system according to claim 15 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

17 . The system according to claim 11 , wherein said hybrid integration optical communication system is operable to generate said second electrical signal in said silicon photonic interposer utilizing a photodetector integrated in said silicon photonic interposer.

18 . The system according to claim 11 , wherein said one or more optical couplers on said silicon photonic interposer comprise grating couplers.

19 . The system according to claim 11 , wherein said one or more electronics die comprise one or more of: a processor core, a switch core, memory, or a router.

20 . A system for communication, the system comprising:
an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to:
receive one or more continuous wave (CW) optical signals in said photonics die from an optical source coupled to said silicon photonic interposer via one or more optical fibers;
generate a modulated optical signal by modulating said one or more received CW optical signals based on a first electrical signal received from one of said one or more CMOS electronics die;
communicate said modulated optical signal through a waveguide in said silicon photonic interposer;
generate a second electrical signal in said silicon photonic interposer based on said communicated modulated optical signal; and
communicate said second electrical signal to another of said one or more CMOS electronics die.

Assignees

• Luxtera Inc

Inventors

• Peterson Mark
• Young Greg
• De Dobbelaere Peter

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/66

  Conductive materials thereof · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title