Light emitting module

Patent metadata

Field	Value
Publication number	US-9349926-B2
Application number	US-201214232364-A
Country	US
Kind code	B2
Filing date	Jun 21, 2012
Priority date	Jul 14, 2011
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

There are provided a light emitting module including a luminescent material layer ( 15 ) which is disposed so as to cover a light emitting surface ( 13 a ) of a semiconductor light emitting element ( 13 ) and which changes a wavelength of at least part of light emitted from the semiconductor light emitting element, and a light shielding wall ( 16 ) which surrounds the semiconductor light emitting element and the luminescent material layer from the circumference thereof, and the luminescent material layer is bonded to the semiconductor light emitting element and the light shielding wall with a bonding resin ( 23 ) having a light transmittivity, a distal end portion of the light shielding wall is caused to project further forwards than the luminescent material layer, and a transparent resin ( 24 ) is applied so as to cover an exposed surface ( 20 a ) of a distal end portion ( 21 ) of the light shielding wall.

First claim

The invention claimed is:

1. A light emitting module comprising:
a semiconductor light emitting element which has a light emitting surface from which light is emitted;
a circuit board on which the semiconductor light emitting element is mounted;
a luminescent material layer which is disposed so as to cover the emitting surface of the semiconductor light emitting element and which changes a wavelength of at least part of light emitted from the semiconductor light emitting element; and
a light shielding wall which is provided on the circuit board and which surrounds the semiconductor light emitting element and the luminescent material layer from the circumference thereof, and
wherein the luminescent material layer is bonded to the semiconductor light emitting element and the light shielding wall with a bonding resin having a light transmittivity,
wherein a distal end portion of the light shielding wall is caused to project further forwards than the luminescent material layer, and
wherein a transparent resin having a light transmittivity is applied so as to cover at least an exposed surface of the distal end portion of the light shielding wall, wherein the transparent resin is applied only to an outer circumferential portion of an opening portion which is formed by the distal end portion of the light shielding wall which is caused to project further forward than the luminescent material layer;
wherein the transparent resin is made of the same material as that of the bonding resin.

2. The light emitting module according to claim 1 , further comprising:
a plurality of semiconductor light emitting elements like the semiconductor light emitting element are mounted side by side at predetermined intervals on the circuit board,
wherein the same number of luminescent material layers like the luminescent material layer as the plurality of semiconductor light emitting elements are disposed so as to cover individually light emitting surfaces of the semiconductor light emitting elements, and
wherein the light shielding wall is provided so as to surround the plurality of semiconductor light emitting elements and the plurality of luminescent material layers from the circumference thereof.

3. The light emitting module according to claim 1 ,
wherein the transparent resin is applied so as to cover the whole of an opening portion which is formed by the distal end portion of the light shielding wall which is caused to project further forwards than the luminescent material layer.

Assignees

• Maeda Shinpei
• Tokida Tsukasa
• Koito Mfg Co Ltd

Inventors

• Maeda Shinpei
• Tokida Tsukasa

Classifications

• F21S41/143 Primary

  the main emission direction of the LED being parallel to the optical axis of the illuminating device · CPC title

• F21S41/151

  arranged in one or more lines · CPC title

• F21S45/435

  circulating the gas within a closed system · CPC title

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title