Semiconductor memory device and method of operating the same

US9349465B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9349465-B2
Application numberUS-201414154839-A
CountryUS
Kind codeB2
Filing dateJan 14, 2014
Priority dateJul 2, 2013
Publication dateMay 24, 2016
Grant dateMay 24, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A semiconductor memory device and a method of operating the same are provided. The semiconductor memory device includes memory cells stacked on a substrate. The method includes applying a reference voltage to an unselected drain select line, applying a drain selection voltage to a selected drain select line, and applying a word line voltage to a normal word line. Before the word line voltage is applied to the normal word line, a positive voltage is applied to a dummy word line to bounce the unselected drain select line.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of operating a semiconductor memory device comprising memory cells stacked on a substrate, the method comprising: applying a reference voltage to an unselected drain select line; applying a drain selection voltage to a selected drain select line; and applying a word line voltage to a normal word line, wherein a precharge voltage is applied to the unselected drain select line before the reference voltage is applied to the unselected drain select line, a positive voltage is applied to a dummy word line when the precharge voltage is applied to the unselected drain select line, the positive voltage is applied to the dummy word line before the word line voltage is applied to the normal word line, and the positive voltage applied to the dummy word line is maintained until the application of the word line voltage is ended. 2. The method of claim 1 , wherein the positive voltage applied to the dummy word line bounces the unselected drain select line. 3. The method of claim 1 , wherein the positive voltage is applied to the dummy word line during the application of the reference voltage to the unselected drain select line. 4. The method of claim 1 , wherein the application of the precharge voltage is ended before the word line voltage is applied to the normal word line. 5. The method of claim 1 , wherein, during the application of the drain selection voltage to the selected drain select line, the positive voltage is applied to the dummy word line. 6. The method of claim 1 , wherein the precharge voltage applied to the unselected drain select line is a first precharge voltage, and before the drain selection voltage is applied to the selected drain select line, the positive voltage is applied to the dummy word line during an application of a second precharge voltage to the selected drain select line. 7. The method of claim 6 , wherein the application of the second precharge voltage is ended before the word line voltage is applied to the normal word line. 8. A semiconductor memory device, comprising: a memory cell array comprising memory cells stacked on a substrate, the memory cells connected with each other into cell strings; and a peripheral circuit configured to apply a reference voltage to an unselected drain select line of an unselected cell string of the cell strings, apply a word line voltage to a normal word line of the cell strings, and apply a positive voltage to a dummy word line of the cell strings before the word line voltage is applied to the normal word line, apply a precharge voltage to the unselected drain select line before the reference voltage is applied to the unselected drain select line, apply the positive voltage to the dummy word line when the precharge voltage is applied to the unselected drain select line, and maintain the positive voltage applied to the dummy word line until the application of the word line voltage is ended. 9. The device of claim 8 , wherein the peripheral circuit is configured to apply the positive voltage to the dummy word line to bounce the unselected drain select line. 10. The device of claim 8 , wherein the peripheral circuit is configured to apply the positive voltage to the dummy word line during the application of the reference voltage to the unselected drain select line. 11. The device of claim 8 , wherein the peripheral circuit is further configured to end the application of the precharge voltage before the word line voltage is applied to the normal word line. 12. The device of claim 8 , wherein the peripheral circuit is further configured to apply the positive voltage to the dummy word line during an application of a drain selection voltage to a selected drain select line of the selected cell string. 13. The device of claim 8 , wherein the precharge voltage applied to the unselected drain select line is a first precharge voltage, and before the drain selection voltage is applied to a selected drain select line of the selected cell string, the peripheral circuit is further configured to apply the positive voltage to the dummy word line during an application of a second precharge voltage to the selected drain select line. 14. The device of claim 13 , wherein the peripheral circuit is configured to end the application of the second precharge voltage before the word line voltage is applied to the normal word line. 15. A memory system, comprising: a semiconductor memory device; and a controller configured to control the semiconductor memory device, wherein the semiconductor memory device comprises: a memory cell array including memory cells stacked on a substrate, the memory cells connected with each other into cell strings; and a peripheral circuit configured to apply a reference voltage to an unselected drain select line of an unselected cell string of the cell strings, apply a word line voltage to a normal word line of the cell strings, and apply a positive voltage to a dummy word line of the cell strings before the word line voltage is applied to the normal word line, apply a precharge voltage to the unselected drain select line before the reference voltage is applied to the unselected drain select line, apply the positive voltage to the dummy word line when the precharge voltage is applied to the unselected drain select line, and maintain the positive voltage applied to the dummy word line until the application of the word line voltage is ended. 16. The system of claim 15 , wherein the peripheral circuit is further configured to apply the positive voltage to the dummy word line to bounce the unselected drain select line.

Assignees

Inventors

Classifications

  • Circuits or methods to prevent or reduce disturbance of the state of a memory cell when neighbouring cells are read or written · CPC title

  • comprising cells having several storage transistors connected in series · CPC title

  • comprising cells containing floating gate transistors (G11C16/0483, G11C16/0491 take precedence) · CPC title

  • G11C16/24Primary

    Bit-line control circuits · CPC title

  • Electricity · mapped topic

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What does patent US9349465B2 cover?
A semiconductor memory device and a method of operating the same are provided. The semiconductor memory device includes memory cells stacked on a substrate. The method includes applying a reference voltage to an unselected drain select line, applying a drain selection voltage to a selected drain select line, and applying a word line voltage to a normal word line. Before the word line voltage is…
Who is the assignee on this patent?
Sk Hynix Inc
What technology area does this patent fall under?
Primary CPC classification G11C16/24. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 24 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).