Mask carrier, mask handling module and method for adjusting a mask

Patent metadata

Field	Value
Publication number	US-9348237-B2
Application number	US-86053310-A
Country	US
Kind code	B2
Filing date	Aug 20, 2010
Priority date	Aug 12, 2010
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

Mask carriers and mask alignment in vacuum deposition processes, mask handling modules, and methods for aligning a mask. A mask handling module can include a substrate carrier for carrying at least one substrate; a mask carrier for carrying at least two masks. The mask carrier can include at least two mask carrier sections each being adapted to carry a mask and a mask carrier positioning device for moving the mask carrier relative to the substrate carrier. The mask carrier sections are arranged so that the masks carried on the mask carrier sections can be positioned on the mask carrier in respective planes forming an angle with respect to each other so that only one of the at least two masks can be aligned to one of the at least one substrates.

First claim

The invention claimed is:

1. A mask handling module for aligning a mask to a substrate, comprising:
a substrate carrier for carrying at least one substrate;
a mask carrier for carrying at least two masks, wherein the mask carrier comprises at least two mask carrier sections each being adapted to carry a mask; and
an actuator coupled to the mask carrier to move the mask carrier relative to the substrate carrier,
wherein the mask carrier sections are arranged so that the masks carried on the mask carrier sections can be positioned on the mask carrier in respective planes forming a nonzero angle with respect to each other, wherein the nonzero angle is in the range from 0.01° to 30°, so that only one mask at a time of the at least two masks can be aligned to one of the at least one substrate, wherein the actuator is adapted to bring the one of the at least two masks into contact with the one of the at least one substrate, wherein at least a part of the mask handling module is configured to operate under vacuum conditions, and wherein the substrate carrier and the mask carrier are arranged so that the at least one substrate and the at least two masks can be held in substantially vertical positions.

2. The mask handling module of claim 1 , wherein while the one of the at least two masks is aligned to one of the at least one substrate, the at least one other mask does not come into contact with the one of the at least one substrate.

3. The mask handling module of claim 1 , wherein the actuator is adapted to align the one of the at least two masks coplanar to one of the at least one substrate.

4. The mask handling module of claim 1 , wherein the substrate carrier is adapted to carry two or more substrates.

5. The mask handling module of claim 4 , wherein the mask handling module is adapted so that each mask of the at least two masks aligns to a different substrate.

6. The mask handling module of claim 1 , wherein the actuator comprises a six-axes movement control.

7. The mask handling module of claim 1 , wherein the mask carrier sections are arranged in a fixed orientation relative to each other.

8. The mask handling module of claim 7 , wherein the actuator is adapted to tilt the mask carrier relative to the substrate carrier about an axis parallel to the at least one substrate.

9. The mask handling module of claim 1 , wherein the mask carrier is adapted to leave the one of the at least two masks on the one of the at least one substrate when the actuator moves the mask carrier away from the substrate carrier.

10. The mask handling module of claim 1 , wherein the actuator is configured to rotate the mask carrier about an axis parallel to the respective planes.

Assignees

• Heumüller Michael
• Landgraf Heike
• König Michael
• Applied Materials Inc

Inventors

• Heumüller Michael
• Landgraf Heike
• König Michael

Classifications

• H10P72/3314

  Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers · CPC title

• H10P72/3311

  Horizontal transfer of a batch of workpieces · CPC title

• H10P72/0478

  the substrates being processed being not semiconductor wafers, e.g. leadframes or chips · CPC title

• H10P72/0461

  characterised by the presence of two or more transfer chambers · CPC title

• H10P72/0456

  in-line arrangement · CPC title