Digital pattern generator (DPG) for E-beam lithography

Patent metadata

Field	Value
Publication number	US-9336993-B2
Application number	US-201414191337-A
Country	US
Kind code	B2
Filing date	Feb 26, 2014
Priority date	Feb 26, 2014
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

A method of lithography including providing a first mirror array and a second mirror array of a digital pattern generator (DPG); the second mirror array is offset from the first mirror array in a first direction. A first data piece and a second data piece associated with an IC device, are received by the DPG. The first and second data piece each defines a state of a pixel of the DPG. The first data piece is provided to a first pixel of the DPG. The second data piece is also provided to the first pixel of the DPG. A first point on a photosensitive layer on a target substrate is exposed. The first point is defined by the first data piece and the second data piece. The target substrate moved in a second direction, perpendicular to the first direction to expose a second point.

First claim

What is claimed is:

1. A method of lithography, comprising:
providing a first mirror array and a second mirror array of a digital pattern generator (DPG), wherein the second mirror array is offset from the first minor array in a first direction;
receiving a first data piece and a second data piece associated with an integrated circuit (IC) device, wherein the first and second data piece each defines a state of a pixel of the DPG;
sending the first data piece to a first pixel of the DPG;
sending the second data piece to the first pixel of the DPG;
during the sending the first data piece and the sending the second data piece, scanning the DPG, wherein the scanning includes scanning the first pixel for a time T, and wherein the first data piece is held in the first pixel for a time T 2 and the second data piece is held in the first pixel for a time T 3 , wherein a sum of T 2 and T 3 is less than or approximately equal to time T;
exposing a first point on a photosensitive layer on a target substrate, wherein the first point is defined by the first data piece and the second data piece; and
moving the target substrate in a second direction, perpendicular to the first direction to expose a second point.

2. The method of claim 1 , wherein the scanning the DPG is in the second direction with a scan speed S/T while sending the first and the second data pieces to the DPG with a signal frequency greater than 1/T, wherein S is the first pixel length in the first direction and T is the time to scan the first pixel length S.

3. The method of claim 1 , further comprising:
providing a third data piece to a second pixel of the DPG, the first pixel being disposed on the first mirror array and the second pixel being disposed on the second minor array; and
wherein the exposure of the first point is also defined by the third data piece.

4. The method of claim 1 , wherein the second mirror array is shifted a distance of a half a pixel length from the first minor array.

5. The method of claim 1 , wherein the first direction is a y-direction.

6. The method of claim 1 , wherein the time T 3 for the second data piece occurs immediately subsequent the time T 2 .

7. The method of claim 1 , wherein the providing the first data piece and the providing the second data piece is performed through a single data line to the first pixel of the DPG.

8. The method of claim 1 , further comprising:
scanning the DPG in the second direction with a scan speed S/T while sending a third data piece and fourth data piece to the first pixel with a signal frequency greater than 1/T,
wherein S is the pixel dimension in the first direction an T is the time to scan over full dimension S of the pixel.

9. A method of operating an electron beam lithography system, comprising:
providing a set of data having a size Nd×Md, wherein Md is greater than 1 and Nd is greater than 1, wherein the set of data includes a first data piece and a second data piece;
providing a digital pattern generator (DPG), wherein the DPG includes a plurality of mirror arrays providing a DPG of size Na×Ma arrays, wherein each of the Na×Ma arrays is offset only in a first direction, and each of the Na×Ma arrays are not offset in a second direction, wherein Nd is equal to Na and Md is greater than Ma, and wherein the plurality of mirror arrays includes a first pixel; and
providing a wafer stage operable to move a target substrate in a second direction, perpendicular the first direction;
sending the first data piece to a first pixel of the DPG;
sending the second data piece to the first pixel of the DPG;
during the sending the first data piece and the sending the second data piece, scanning the DPG, wherein the scanning includes scanning the first pixel for a time T, and wherein the first data piece is held in the first pixel for a time T 2 and the second data piece is held in the first pixel for a time T 3 , wherein a sum of T 2 and T 3 is less than or approximately equal to time T; and
exposing a first point on a photosensitive layer on the target substrate disposed on the wafer stage, wherein the first point is defined by the first data piece and the second data piece.

10. The method of claim 9 , Na is one and Ma is two mirror arrays.

11. The method of claim 9 , wherein the offset in the first direction is a distance of ½ of a pixel of one of the plurality of mirror arrays.

12. The method of claim 9 , wherein the DPG includes three minor arrays, such that Na is one and Ma is two, and wherein the offset in the first direction is a distance of ⅓ of a pixel of one of the plurality of minor arrays.

13. The method of claim 9 , further comprising:
a single data line connected to a first pixel of a first minor array of the plurality of mirror arrays.

14. A method for a lithography process for reducing a critical dimension (CD) by a factor n wherein n<1, comprising:
providing a digital pattern generator (DPG); and
scanning the DPG in a first direction during the lithography process with a scan speed S/T such that a first pixel of the DPG has a full dimension S that is scanned in time T, while scanning sending a data signal to the DPG with a signal frequency greater than 1/T, such that a first data piece and a second data piece are delivered and occupy the first pixel during the time T, wherein the scanning includes:
sending the first data piece to the first pixel;
sending the second data piece to the first pixel;
and wherein the first data piece is held in the first pixel for a time T 2 and the second data piece is held in the first pixel for a time T 3 , wherein a sum of T 2 and T 3 is less than or approximately equal to time T; and
exposing a first point on a photosensitive layer on a target substrate, wherein the first point is defined by the first data piece and the second data piece.

15. The method of claim 14 , wherein the signal frequency is 2* 1/T.

16. The method of claim 14 , wherein the signal frequency is 3* 1/T.

17. The method of claim 14 , wherein the first direction is an x-direction.

18. The method of claim 14 , wherein the providing the DPG includes configuring a first minor array and a second mirror array, wherein the second mirror array is offset from the first mirror array in a second direction, perpendicular the first direction.

19. The method of claim 14 , further comprising:
providing a third data piece to the first pixel of the DPG during the time T.

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Yu Tsung-Hsin

Classifications

• H01J37/147

  Arrangements for directing or deflecting the discharge along a desired path ({H01J37/045 take precedence;} lenses H01J37/10) · CPC title

• H01J37/24

  Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for · CPC title

• H01J2237/20221

  Translation · CPC title

• H01J37/3174 Primary

  Particle-beam lithography, e.g. electron beam lithography · CPC title

• H01J37/20

  Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support · CPC title