High performance compliant wafer test probe

Patent metadata

Field	Value
Publication number	US-9335346-B2
Application number	US-201213608706-A
Country	US
Kind code	B2
Filing date	Sep 10, 2012
Priority date	Apr 30, 2010
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

First claim

What is claimed is:

1. An array of electrical connections comprising:
a first substrate comprising a first array of contacts, the first array of contacts comprising:
a deformable pad disposed on a first surface of the first substrate, wherein the deformable pad comprises a plurality of recessed depressions formed in the deformable pad, wherein the deformable pad is formed of a deformable material;
a plurality of first recessed electrical contacts formed in the recessed depressions of the deformable pad, respectively, wherein the first recessed electrical contacts are formed of an electrically conductive material that lines sidewall and bottom surfaces of each of the recessed depressions of the deformable pad; and
a plurality of conductive vias formed in the first substrate in direct contact with the first recessed electrical contacts, respectively; and

a second substrate comprising a second array of contacts, the second array of contacts comprising a plurality of second electrical contacts;
wherein the first substrate and the second substrate are mounted to each other with the second array of contacts aligned to the first array of contacts and with the second electrical contacts in direct contact with the first recessed electrical contacts; and
wherein when the first substrate and the second substrate are mounted to each other, the deformable pad is configured to at least partially cause at least one lateral force on the first recessed electrical contacts, so as to induce the first recessed electrical contacts to make electrical contact with the second electrical contacts.

2. The array of electrical connections of claim 1 , wherein a pitch between adjacent contacts of the first array of contacts 400 microns or less.

3. The array of electrical connections of claim 1 , wherein a pitch between adjacent contacts of the first array of contacts is between 15 microns and 400microns.

4. The array of electrical connections of claim 1 ., wherein at least one of the first recessed electrical contacts comprises a tapered sidewall.

5. The array of electrical connections of claim 1 , wherein at least one of the first recessed electrical contacts comprises a non-tapered sidewall.

6. The array of electrical connections of claim 1 , wherein at least one of the first recessed electrical contacts comprises a slit formed in a sidewall of the first recessed electrical contact.

7. The array of electrical connections of claim 1 , wherein the deformable material comprises a material having a Young's modulus of less than 1,000,000 psi.

8. The array of electrical connections of claim 1 , wherein the deformable material comprises polyimide.

9. The array of electrical connections of claim 1 . wherein the deformable material comprises a cured photoresist material.

10. The array of electrical connections of claim 1 , wherein the second electrical contacts comprise solder bumps.

11. An array of electrical connections comprising:
a first substrate comprising a first array of contacts, the first array of contacts comprising,:
a plurality of deformable pads disposed on a first surface of the first substrate, wherein each deformable pad includes a recessed depression formed in the deformable pad, wherein the deformable pads are formed of a deformable material;
a plurality of first recessed electrical contacts formed in the recessed depressions of the deformable pads, respectively, wherein the first recessed electrical contacts are formed of an electrically conductive material that lines sidewall and bottom surfaces of each of the recessed depressions of the deformable pads; and
a plurality of conductive vias formed in the first substrate in direct contact with the first recessed electrical contacts, respectively; and

a second substrate comprising a second array of contacts, the second array of contacts comprising a plurality of second electrical contacts;
wherein the first substrate and the second substrate are mounted to each other with the second array of contacts aligned to the first array of contacts and with the second electrical contacts in direct contact with the first recessed electrical contacts; and
wherein when the first substrate and the second substrate are mounted to each other, the deformable pads are configured to at least partially cause at least one lateral force on the first recessed electrical contacts, so as to induce the first recessed electrical contacts to make electrical contact with the second electrical contacts.

12. The array of electrical connections of claim 11 , wherein a pitch between adjacent contacts of the first array of contacts 400 microns or less.

13. The array of electrical connections of claim 11 , wherein a pitch between adjacent contacts of the first array of contacts is between 15 microns and 400 microns.

14. The array of electrical connections of claim 11 , wherein at least one of the first recessed electrical contacts comprises a tapered sidewall.

15. The array of electrical connections of claim 11 , wherein at least one of the first recessed electrical contacts comprises a non-tapered sidewall.

16. The array of electrical connections of claim 11 , wherein at least one of the first recessed electrical contacts comprises a slit formed in a sidewall of the first recessed electrical contact.

17. The array of electrical connections of claim 11 , wherein the deformable material comprises a material having a Young's modulus of less than 1,000,000 psi.

18. The array of electrical connections of claim 11 , wherein the deformable material comprises polyimide.

19. The array of electrical connections of claim 11 , wherein the deformable material comprises a cured photoresist material.

20. The array of electrical connections of claim 11 , wherein the second electrical contacts comprise solder bumps.

Assignees

• Chey S Jay
• Fregeau Dustin M
• Zupanski-Nielsen Donna S
• Prabhakar Aparna
• Samudrala Pavan
• Shaikh Mohammed S
• Globalfoundries Inc

Inventors

• Chey S Jay
• Fregeau Dustin M
• Zupanski-Nielsen Donna S
• Prabhakar Aparna
• Samudrala Pavan
• Shaikh Mohammed S

Classifications

• G01R1/06716 Primary

  Elastic · CPC title

• G01R1/06733

  Geometry aspects (G01R1/06727 takes precedence) · CPC title

• G01R1/06755

  Material aspects · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title