Etching method

Patent metadata

Field	Value
Publication number	US-9332647-B2
Application number	US-201314436475-A
Country	US
Kind code	B2
Filing date	Oct 9, 2013
Priority date	Oct 19, 2012
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

A solution is characteristic in being an etching method that processes a surface of a target object by corroding the surface by a corrosive, and the etching method includes: a resist forming step of forming a resist on the surface using resist liquid by ink jet printing the resist liquid on the surface; a surface corroding step of corroding a portion of the surface where the resist is not formed by bringing the corrosive into contact with a surface side of the target object where the resist has been formed in the resist forming step; and a resist detaching step of detaching the resist from the surface after the surface corroding step, wherein the resist forming step is a step of forming the resist by the resist liquid containing monofunctional monomers or monofunctional oligomers, and polyfunctional monomers or polyfunctional oligomers.

First claim

The invention claimed is:

1. An etching method that processes a surface of a target object by corroding the surface by a corrosive, and the etching method comprising:
a resist forming step of forming a resist on the surface using resist liquid by ink jet printing the resist liquid on the surface;
a surface corroding step of corroding a portion of the surface where the resist is not formed by bringing the corrosive into contact with a surface side of the target object where the resist was formed in the resist forming step; and
a resist detaching step of detaching the resist from the surface after the surface corroding step,
wherein the resist forming step is a step of forming the resist by the resist liquid containing monofunctional monomers or monofunctional oligomers, and amine-modified acrylic oligomers as polyfunctional monomers,
the surface corroding step is wet etching to corrode by a liquid corrosive.

2. The etching method according to claim 1 , wherein
the resist forming step is a step of forming the resist by the resist liquid containing the monofunctional monomers or the monofunctional oligomers by 40 mass % or more, and the polyfunctional monomers or the polyfunctional oligomers by 30 mass % or less.

3. The etching method according to claim 1 , wherein
the resist forming step is an UV ink jet printing step, which prints the resist liquid of an ultraviolet curing type.

4. The etching method according to claim 1 , wherein
the resist forming step is a step of forming the resist by the resist liquid containing isobornyl acrylate as the monofunctional monomers.

5. The etching method according to claim 1 , wherein
the resist forming step is a step of forming the resist by the resist liquid containing acrylic ester as the monofunctional monomers.

Assignees

• Mimaki Eng Kk

Inventors

• Nakamura Norikazu

Classifications

• H05K2203/0551

  Exposure mask directly printed on the PCB · CPC title

• H05K2203/013

  Inkjet printing, e.g. for printing insulating material or resist · CPC title

• H05K2203/0562

  Details of resist · CPC title

• H05K3/064 Primary

  Photoresists · CPC title

• H05K3/0076

  characterised by the composition of the mask · CPC title