Spalling with laser-defined spall edge regions

Patent metadata

Field	Value
Publication number	US-9324564-B2
Application number	US-201514797990-A
Country	US
Kind code	B2
Filing date	Jul 13, 2015
Priority date	Nov 22, 2011
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.

First claim

What is claimed is:

1. A method of removing a material layer region of a base substrate, said method comprising:
forming a material stack comprising at least a plating seed layer atop an uppermost surface of a base substrate;
forming a trench by laser ablation at least within the material stack to define an edge of a material layer region to be spalled;
forming a stressor layer portion on a non-ablated portion of the material stack; and
spalling the material layer region of the base substrate.

2. The method of claim 1 , wherein said material stack further includes a metal-containing adhesion layer located beneath said plating seed layer.

3. The method of claim 1 , wherein said forming said stressor layer portion comprises a selective plating process.

4. The method of claim 1 , wherein said stressor layer portion is a metal, a polymer or any combination thereof.

5. The method of claim 4 , wherein said stressor layer portion includes at least said polymer, and said polymer is a stress inducing tape layer.

6. The method of claim 1 , wherein said laser ablation comprises pulsed irradiation performed at one of a fluence per pulse from 0.1 to 200 J/cm 2 and a power density from 1×10 8 to 1×10 14 W/cm 2 .

7. The method of claim 1 , wherein said trench has a shape of a polygon, circle, flexible interconnect nested rings or linked squares.

8. The method of claim 1 , wherein said spalling is performed at room temperature or a temperature less than room temperature.

9. The method of claim 1 , further comprising forming a handle substrate atop said stressor layer portion prior to spalling.

10. A method of removing a material layer region of a base substrate, said method comprising:
forming at least a stressor layer atop an uppermost surface of a base substrate;
forming a trench by laser ablation within a vertical sidewall portion of the base substrate, said trench defining an edge of a material layer region of the base substrate to be spalled; and
spalling the material layer region of the base substrate.

11. The method of claim 10 , further comprising at least one of a metal-containing adhesion layer and a plating seed layer located beneath said stressor layer.

12. The method of claim 10 , wherein said stressor layer is a metal, a polymer or any combination thereof.

13. The method of claim 12 , wherein said stressor layer includes at least said polymer, and said polymer is a stress inducing tape layer.

14. The method of claim 10 , wherein said spalling is performed at room temperature or a temperature less than room temperature.

15. The method of claim 10 , further comprising forming a handle substrate atop said stressor layer portion prior to spalling.

Assignees

• IBM
• King Abdulaziz City Sci & Tech

Inventors

• Alhomoudi Ibrahim
• Bedell Stephen W
• Cheng Cheng-Wei
• Fogel Keith E
• Sadana Devendra K
• Saenger Katherine L
• Sosa Norma E
• Li Ning

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P50/286

  of organic materials · CPC title

• H10P50/262

  by physical means only · CPC title

• H10P34/42 Primary

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title