Die bonder and a method of cleaning a bond collet

Patent metadata

Field	Value
Publication number	US-9318362-B2
Application number	US-201414578695-A
Country	US
Kind code	B2
Filing date	Dec 22, 2014
Priority date	Dec 27, 2013
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

A die bonder comprises a movable bond collet for holding an electronic device, and a platform which comprises a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface. The die bonder also comprises a cleaning agent supply, wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.

First claim

What is claimed is:

1. A die bonder, comprising:
a movable bond collet for holding an electronic device;
a platform comprising a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface, wherein the platform is movable between a first position and a second position;
a biasing mechanism configured to bias the platform towards the first position; and
a cleaning agent supply;
wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.

2. The die bonder of claim 1 , wherein the cleaning surface comprises a textile material.

3. The die bonder of claim 2 , wherein the textile material comprises a clean room cloth.

4. The die bonder of claim 1 , wherein the cleaning agent supply is operative to provide further cleaning agent to the cleaning surface each time the bond collet contacts the platform.

5. The die bonder of claim 1 , wherein the biasing mechanism comprises a helical spring.

6. The die bonder of claim 1 , wherein the cleaning agent supply is operative to provide further cleaning agent to the cleaning surface each time the bond collet moves the platform away from the first position.

7. The die bonder of claim 1 , further comprising a pump for pumping the cleaning agent from the cleaning agent supply so as to provide the cleaning agent to the cleaning surface.

8. The die bonder of claim 7 , wherein the pump is an antistatic pump.

9. The die bonder of claim 7 , wherein the cleaning agent supply comprises a container on which the platform is mounted.

10. A die bonder, comprising:
a movable bond collet for holding an electronic device;
a platform comprising a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface;
a resilient material on which the cleaning surface is arranged, so as to reduce impact on the bond collet when the bond collet contacts the cleaning surface; and
a cleaning agent supply;
wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.

11. The die bonder of claim 10 , wherein the resilient material is a rubber sheet.

12. The die bonder of claim 1 , further comprising a camera adjacent to which the bond collet is positionable for inspecting the bond collet after the bond collet has been cleaned on the cleaning surface.

13. A method of cleaning a bond collet of a die bonder which is configured for holding an electronic device, the method comprising the steps of:
providing a cleaning agent to a cleaning surface comprised in a platform from a cleaning agent supply;
contacting the bond collet on the cleaning surface;
pushing the platform with the bond collet from a first position to a second position when contacting the bond collet on the cleaning surface; and
cleaning the bond collet on the cleaning surface.

14. The method of claim 13 , further comprising the step of dispensing the cleaning agent to the cleaning surface when the platform is pushed away from the first position.

15. The method of claim 13 , wherein the step of dispensing the cleaning agent to the cleaning surface is carried out by a pump.

16. The method of claim 13 , further comprising the step of inspecting the bond collet with a camera after cleaning the bond collet.

Assignees

• Leung Mei Po
• Lee Wing Yin
• Chong Chi Ming
• Asm Tech Singapore Pte Ltd

Inventors

• Leung Mei Po
• Lee Wing Yin
• Chong Chi Ming

Classifications

• H10P72/0411

  for wet cleaning or washing · CPC title

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• B23K3/028

  Devices for cleaning soldering iron tips (B23K3/027 takes precedence) · CPC title

• B23K3/029

  Solder or residue removing devices · CPC title

• H01L21/6704

  Electricity · mapped topic