Circuit board, electronic device, and production method for circuit board
US-12156346-B2 · Nov 26, 2024 · US
Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutions
US9313898B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9313898-B2 |
| Application number | US-27545808-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 21, 2008 |
| Priority date | Nov 21, 2008 |
| Publication date | Apr 12, 2016 |
| Grant date | Apr 12, 2016 |
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- Title
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Abstract
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An electrical component that includes a substrate and a polymeric layer oriented in working relation with the substrate, the polymeric layer including a low molecular mass polyimide.
First claim
Opening claim text (preview).
The invention claimed is: 1. An electrical component, the electrical component comprising: a substrate; and a polymeric layer in working relation with the substrate, the polymeric layer comprising a low molecular mass polyimide having the chemical structure of formula XXIII, or an isomer thereof: wherein M is an integer ranging from as low as about 10 to as high as about 100 and: R 1 is a carbonyl group; or R 1 is an alkenyl group of formula C n H 2n−2 and n of formula C n H 2n−2 is an integer ranging from as low as 2 to as high as 12; or R 1 is an alkenyl group of formula C n H 2n−4 and n of formula C n H 2n−4 is an integer ranging from as low as 2 to as high as 12; or R 1 is an alkenyl group of formula C n H 2n−6 and n of formula C n H 2n−6 is an integer ranging from as low as 3 to as high as 12.
Assignees
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Classifications
containing sulfur · CPC title
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title
Inkjet printing, e.g. for printing insulating material or resist · CPC title
Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain · CPC title
Polyimide · CPC title
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Frequently asked questions
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- What does patent US9313898B2 cover?
- An electrical component that includes a substrate and a polymeric layer oriented in working relation with the substrate, the polymeric layer including a low molecular mass polyimide.
- Who is the assignee on this patent?
- Mengel Manfred, Mahler Joachim, Infineon Technologies Ag
- What technology area does this patent fall under?
- Primary CPC classification H05K3/285. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).